Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties

• US 9,671,429 B2
• Filed: 09/04/2013
• Issued: 06/06/2017
• Est. Priority Date: 05/07/2003
• Status: Active Grant

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Wu, Ming Ting, Kumar, Ananda H., Larsen, III, Rulon J., Lockard, Michael S., Smalley, Dennis R., Kim, Young, Kim, Kieun, Cohen, Adam L.
• Primary Examiner(s): SAMPLE, DAVID R
• Application Number:
  US14/017,535
• Publication Number:
  US 20140134453A1
• Time in Patent Office: 1,371 Days
• Field of Search: None
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: G01R 1/06761 related to layers
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]

Abstract

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.

Claims

1. A multi-layer millimeter scale or micro-scale structure, comprising:

a) a first planarized layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and the bottom of the at least one core material, and wherein the first planarized layer has first lateral extents; and

b) at least one intermediate planarized layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and joins the shell material of the first planarized layer or a lower intermediate layer, and wherein the at least one intermediate planarized layer has lateral extents that are different from the first lateral extents such that the at least one intermediate planarized layer may be distinguished from the first planarized layer;

c) a second planarized layer comprising a capping material located directly on a adjacent intermediate layer such that the second planarized layer provides for the bounding of the core material on the adjacent intermediate layer from above, and wherein the second planarized layer has second lateral extents different from the lateral extents of the at least one intermediate planarized layer such that the second planarized layer can be distinguished from the at least one intermediate planarized layer,

wherein the shell material and the capping material fully encapsulate the core material, and

wherein a thickness of each layer of the multi-layer structure is in the range of 1 to 50 microns.

2. The structure of claim 1 wherein the at least one core material is a single material.

3. The structure of claim 2 wherein the at least one shell material is a single material.

4. The structure of claim 3 wherein the at least one capping material is a single material.

5. The structure of claim 1 wherein the structure comprises a compliant electronic contact element for testing integrated circuits.

6. The structure of claim 5 additionally comprising a contact tip material forming part of at least one layer.

7. The structure of claim 6 wherein the contact tip material is different from the shell material, the core material, and capping material.

8. The structure of claim 1 comprising at least two isolated regions of core material.

9. A multi-layer millimeter scale or micro-scale structure, comprising:

a) a first planarized layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and the bottom of the at least one core material; and

b) at least one intermediate planarized layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and joins the shell material of the first planarized layer or a lower intermediate layer;

c) a second planarized layer comprising a capping material located directly on an adjacent intermediate layer such that the second planarized layer provides for the bounding of the core material on the adjacent intermediate layer from above,

wherein the shell material and the capping material fully encapsulate the core material,

wherein a thickness of each layer of the multi-layer structure is in the range of 1 to 50 microns,

wherein the at least one core material is a single material,

wherein the at least one shell material and the at least one capping material are each single materials and are the same material, and are selected from the group consisting of (1) nickel (Ni), (2) copper (Cu), (3) beryllium copper (BeCu), (4) nickel phosphorous (Ni—

P), (5) tungsten (W), (6) aluminum copper (Al—

Cu), (7) steel, (8) P7 alloy, (9) palladium, (10) molybdenum, (11) manganese, (12) brass, (13) chrome, (14) chromium copper (Cr—

Cu), and (15) combinations of these.

10. A multi-layer structure, comprising:

a) a first layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and the bottom of the at least one core material, and wherein the first layer has first lateral extents; and

b) at least one intermediate layer comprising at least one core material and at least one shell material, whereby the at least one shell material completely surrounds the sides of the at least one core material and joins the shell material of the first layer or a lower intermediate layer, and wherein the at least one intermediate layer has lateral extents that are different from the first lateral extents such that the at least one intermediate layer may be distinguished from the first layer;

c) a second layer comprising a capping material located directly on an adjacent intermediate layer such that the second layer provides for the bounding of the core material on the adjacent intermediate layer from above, and wherein the second layer has second lateral extents are different from the lateral extents of the at least one intermediate layer such that the second layer can be distinguished from the at least one intermediate layer,

wherein the shell material and the capping material fully encapsulate the core material, and wherein the at least one shell material, the at least one core material, and the at least one capping material are metals.