3D IC testing apparatus
First Claim
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1. A method comprising:
- connecting a testing setup having a plurality of probes to a device under test having a plurality of vias in a first substrate, wherein a probe is aligned with a corresponding via of the device under test, the first substrate being electrically coupled to a semiconductor die using micro bumps, the semiconductor die having a conductive element; and
conducting a plurality of via electrical characteristic tests through a conductive path comprising the plurality of vias, the probes, the semiconductor die and the conductive element, the conductive element electrically coupling two adjacent probes, wherein the first substrate is stacked on a first side of the semiconductor die, and wherein the conductive element is on a second side of the semiconductor die.
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Abstract
A method comprises connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test and conducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup.
14 Citations
18 Claims
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1. A method comprising:
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connecting a testing setup having a plurality of probes to a device under test having a plurality of vias in a first substrate, wherein a probe is aligned with a corresponding via of the device under test, the first substrate being electrically coupled to a semiconductor die using micro bumps, the semiconductor die having a conductive element; and conducting a plurality of via electrical characteristic tests through a conductive path comprising the plurality of vias, the probes, the semiconductor die and the conductive element, the conductive element electrically coupling two adjacent probes, wherein the first substrate is stacked on a first side of the semiconductor die, and wherein the conductive element is on a second side of the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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providing a device under test comprising a plurality of through vias and a connection device coupled between two adjacent through vias; connecting a testing setup having a plurality of probes to the device under test, wherein a probe is aligned with a corresponding via of the device under test and the testing setup comprises a plurality of conductive devices, each of which connects two adjacent probes; forming a conductive chain comprising the plurality of through vias of the device under test, the probes, the connection device, a first micro bump, a second micro bump and the plurality of conductive devices as a result of connecting the testing setup having a plurality of probes to the device under test, wherein the first micro bump and the second micro bump are between and in contact with the plurality of through vias of the device under test and a first side of a semiconductor die, and wherein the connection device is on a second side of the semiconductor die and connected to the first micro bump and the second micro bump through connecting elements embedded in the semiconductor die; and conducting a plurality of via electrical characteristic tests through the conductive chain. - View Dependent Claims (9, 10, 11, 12)
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13. A method comprising:
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providing a plurality of connection devices formed in a testing apparatus; and forming a through silicon via (TSV) chain by coupling a plurality of TSVs in a device under test (DUT) with the plurality of connection devices, wherein the TSV chain comprises a first micro bump between and in contact with a first via of the plurality of TSVs and a first side of a semiconductor die, and a second micro bump between and in contact with a second via of the plurality of TSVs and the first side of the semiconductor die, and wherein at least one conductive element is on a second side of the semiconductor die and directly connects two vias of the semiconductor die. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification