Composite chassis for lowering surface temperature

• US 9,671,838 B2
• Filed: 01/10/2013
• Issued: 06/06/2017
• Est. Priority Date: 01/10/2013
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: North, Travis C., Aurongzeb, Deeder M.
• Primary Examiner(s): Sinclair, David M
• Assistant Examiner(s): BROWN, ROBERT D
• Application Number:
  US13/738,271
• Publication Number:
  US 20140192474A1
• Time in Patent Office: 1,608 Days
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.

Claims

1. A chassis, comprising:

a chassis base defining a housing that is configured to house a plurality of components, wherein the chassis base includes a chassis wall having an outer surface that is located on the chassis wall and a housing surface that is located on the chassis wall opposite the chassis wall from the outer surface;

a first layer of the chassis wall that provides the outer surface of the chassis wall, wherein the first layer includes a first material and a first layer oxidized surface of the first material that has been oxidized and that is located opposite the first layer from the outer surface of the chassis wall; and

a second layer of the chassis wall that is located immediately adjacent the housing and that provides the housing surface, wherein the second layer includes a carbide-based composite material throughout the second layer and a second layer oxidized surface of the carbide-based composite material that has been oxidized and that is bonded with the first layer oxidized surface, and wherein the carbide-based composite material provides a thermal conductivity of less than 1 watt per meter-kelvin throughout the chassis wall in a direction that is generally perpendicular to the outer surface of the chassis wall, while providing a thermal conductivity of at least 100 W/mK throughout the chassis wall in directions that are generally parallel to the outer surface of the chassis wall.

2. The chassis of claim 1, wherein the carbide-based composite material includes a graphene material and a polymer material.

3. The chassis of claim 1, wherein the carbide-based composite material includes a graphene material, a polymer material, and an aerogel material.

4. The chassis of claim 1, wherein the second layer is less than 500 micrometers thick, and the first layer and the second layer have a combined thickness of 1 millimeter or less.

5. The chassis of claim 1, wherein the second layer oxidized surface includes a graphene oxide material.

6. The chassis of claim 1, wherein the first layer includes one of an Aluminum material or a Magnesium material.

7. An information handling system (IHS), comprising:

a chassis wall including an outer surface and a housing surface that is located opposite the chassis wall from the outer surface, wherein the chassis wall define a portion of a chassis housing;

a processing system located in the chassis housing;

a memory system coupled to the processing system and located in the chassis housing;

a first layer of the chassis wall that provides the outer surface of the chassis wall and includes a first material and a first layer oxidized surface of the first material that has been oxidized and that is located opposite the first layer from the outer surface of the chassis wall; and

a second layer of the chassis wall that is located immediately adjacent the chassis housing and that provides the housing surface, wherein the second layer includes a carbide-based composite material throughout the second layer and a second layer oxidized surface of the carbide-based composite material that has been oxidized and that is bonded with the first layer oxidized surface, and wherein the carbide-based composite material provides a thermal conductivity of less than 1 watt per meter-kelvin throughout the IHS chassis wall in a direction that is generally perpendicular to the outer surface of the chassis wall, while providing a thermal conductivity of at least 100 W/mK throughout the chassis wall in directions that are generally parallel to the outer surface of the chassis wall.

8. The IHS of claim 7, wherein the carbide-based composite material includes a graphene material and a polymer material.

9. The IHS of claim 7, wherein the carbide-based composite material includes a graphene, a polymer material, and an aerogel material.

10. The IHS of claim 7, wherein the second layer is less than 500 micrometers thick, and the first layer and the second layer have a combined thickness of 1 millimeter or less.

11. The IHS of claim 7, wherein the second layer oxidized surface includes a graphene oxide material.

12. The IHS of claim 7, wherein the first layer includes one of an Aluminum material or a Magnesium material.