Composite chassis for lowering surface temperature
First Claim
1. A chassis, comprising:
- a chassis base defining a housing that is configured to house a plurality of components, wherein the chassis base includes a chassis wall having an outer surface that is located on the chassis wall and a housing surface that is located on the chassis wall opposite the chassis wall from the outer surface;
a first layer of the chassis wall that provides the outer surface of the chassis wall, wherein the first layer includes a first material and a first layer oxidized surface of the first material that has been oxidized and that is located opposite the first layer from the outer surface of the chassis wall; and
a second layer of the chassis wall that is located immediately adjacent the housing and that provides the housing surface, wherein the second layer includes a carbide-based composite material throughout the second layer and a second layer oxidized surface of the carbide-based composite material that has been oxidized and that is bonded with the first layer oxidized surface, and wherein the carbide-based composite material provides a thermal conductivity of less than 1 watt per meter-kelvin throughout the chassis wall in a direction that is generally perpendicular to the outer surface of the chassis wall, while providing a thermal conductivity of at least 100 W/mK throughout the chassis wall in directions that are generally parallel to the outer surface of the chassis wall.
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Accused Products
Abstract
An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.
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Citations
12 Claims
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1. A chassis, comprising:
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a chassis base defining a housing that is configured to house a plurality of components, wherein the chassis base includes a chassis wall having an outer surface that is located on the chassis wall and a housing surface that is located on the chassis wall opposite the chassis wall from the outer surface; a first layer of the chassis wall that provides the outer surface of the chassis wall, wherein the first layer includes a first material and a first layer oxidized surface of the first material that has been oxidized and that is located opposite the first layer from the outer surface of the chassis wall; and a second layer of the chassis wall that is located immediately adjacent the housing and that provides the housing surface, wherein the second layer includes a carbide-based composite material throughout the second layer and a second layer oxidized surface of the carbide-based composite material that has been oxidized and that is bonded with the first layer oxidized surface, and wherein the carbide-based composite material provides a thermal conductivity of less than 1 watt per meter-kelvin throughout the chassis wall in a direction that is generally perpendicular to the outer surface of the chassis wall, while providing a thermal conductivity of at least 100 W/mK throughout the chassis wall in directions that are generally parallel to the outer surface of the chassis wall. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An information handling system (IHS), comprising:
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a chassis wall including an outer surface and a housing surface that is located opposite the chassis wall from the outer surface, wherein the chassis wall define a portion of a chassis housing; a processing system located in the chassis housing; a memory system coupled to the processing system and located in the chassis housing; a first layer of the chassis wall that provides the outer surface of the chassis wall and includes a first material and a first layer oxidized surface of the first material that has been oxidized and that is located opposite the first layer from the outer surface of the chassis wall; and a second layer of the chassis wall that is located immediately adjacent the chassis housing and that provides the housing surface, wherein the second layer includes a carbide-based composite material throughout the second layer and a second layer oxidized surface of the carbide-based composite material that has been oxidized and that is bonded with the first layer oxidized surface, and wherein the carbide-based composite material provides a thermal conductivity of less than 1 watt per meter-kelvin throughout the IHS chassis wall in a direction that is generally perpendicular to the outer surface of the chassis wall, while providing a thermal conductivity of at least 100 W/mK throughout the chassis wall in directions that are generally parallel to the outer surface of the chassis wall. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification