Micro lead frame structure having reinforcing portions and method
First Claim
Patent Images
1. A packaged electronic device, comprising:
- a die pad having peripheral edge segments;
a plurality of first leads segregated into at least two sets that extend along the respective ones of at least two peripheral edge segments of the die pad, wherein each first lead includes a first bond finger proximate to the die pad and a first support bar extending from a distal end of the first bond finger in a direction away from the die pad, and wherein the first support bar includes a stiffness reinforcing structure extending along a top surface of the first support bar, and wherein the stiffness reinforcing structure is defined by two opposed and spaced apart recessed portions disposed in the first support bar;
an electronic die electrically coupled to at least some of the first leads; and
a package body defining generally planar bottom and side surfaces, the package body at least partially encapsulating the first leads and the electronic die such that at least portions of the first leads are exposed in the bottom surface of the package body.
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Abstract
In one embodiment, a micro lead frame structure includes one or more stiffness reinforcing structures formed on leads and/or connecting structures. The stiffness reinforcing structures can be formed by leaving predetermined portions of the micro lead frame at full thickness including, for example, portions of an inner lead, portions of an outer lead, and portions of a connecting bar, combinations thereof, and other structures. The stiffness reinforcing structures are configured to reduce deformation defects and electrical short defects caused by assembly processes.
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Citations
20 Claims
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1. A packaged electronic device, comprising:
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a die pad having peripheral edge segments; a plurality of first leads segregated into at least two sets that extend along the respective ones of at least two peripheral edge segments of the die pad, wherein each first lead includes a first bond finger proximate to the die pad and a first support bar extending from a distal end of the first bond finger in a direction away from the die pad, and wherein the first support bar includes a stiffness reinforcing structure extending along a top surface of the first support bar, and wherein the stiffness reinforcing structure is defined by two opposed and spaced apart recessed portions disposed in the first support bar; an electronic die electrically coupled to at least some of the first leads; and a package body defining generally planar bottom and side surfaces, the package body at least partially encapsulating the first leads and the electronic die such that at least portions of the first leads are exposed in the bottom surface of the package body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A packaged semiconductor structure, comprising:
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a die pad having peripheral edge segments; a plurality of first leads extending along a peripheral edge segment of the die pad, wherein each first lead includes a first bond finger proximate to the die pad and a first support bar extending from a distal end of the first bond finger, and wherein the first support bar includes a stiffness reinforcing structure extending along a top surface of the first support bar, and wherein the stiffness reinforcing structure is defined by at least one recessed portion disposed extending inward from the top surface of the first support bar; a semiconductor die attached to the die pad and electrically coupled to at least some of the first leads; and a package body defining generally planar bottom and side surfaces, the package body at least partially encapsulating the first leads and the semiconductor die such that at least portions of the first leads are exposed in the bottom surface and a side surface of the package body. - View Dependent Claims (12, 13, 14, 15)
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16. A packaged semiconductor device comprising:
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a first lead comprising; a first bond finger, and a first support bar extending from the first bond finger, wherein the first support bar includes a stiffness reinforcing structure along a top surface of the first support bar, wherein the stiffness reinforcing structure is configured to reduce movement of the first lead during assembly, and wherein the stiffness reinforcing structure is bounded on two sides by recessed regions formed along the top surface of the first support bar; a semiconductor die electrically coupled to the first lead; and a package body defining a generally planar bottom surface and a side surface, the package body at least partially encapsulating the first lead and the semiconductor die such that at least portions of the first bond finger is exposed in the bottom surface of the package body. - View Dependent Claims (17, 18, 19, 20)
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Specification