Integrated inductor for integrated circuit devices
First Claim
1. A device, comprising:
- a semiconductor die having a body, a front side, a back side, and a first through-body-via-based inductor disposed in the die and having a first turn which includes first and second conductive through-body-vias passing through the body of the die from the front side of the die to the back side of the die, said first and second through-body-vias each having a front side end at the front side of the die and said first and second through-body-vias each having a back side end at the back side of the die;
said first turn further including first and second stack conductors disposed on the front side of the die and coupled to the first and second through-body-vias, respectively, each stack conductor comprising;
an interleaved stack of electrically conductive metal layers separated by insulation layers disposed at the front side of the die; and
a plurality of conductive through-layer-vias in each insulation layer, each through-layer-via passing through an insulation layer and electrically coupling adjacent metal layers of the stack conductor; and
a transformer having a core in the die body, said transformer including said first through-body-via based inductor and including a second through-body-via-based inductor in the die having first and second turns, wherein the first and second turns of the first and second through-body-via-based inductors are interwound so that the first and second through-body-via-based inductors are inductively coupled together and share the core in the die body.
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Accused Products
Abstract
A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.
35 Citations
11 Claims
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1. A device, comprising:
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a semiconductor die having a body, a front side, a back side, and a first through-body-via-based inductor disposed in the die and having a first turn which includes first and second conductive through-body-vias passing through the body of the die from the front side of the die to the back side of the die, said first and second through-body-vias each having a front side end at the front side of the die and said first and second through-body-vias each having a back side end at the back side of the die; said first turn further including first and second stack conductors disposed on the front side of the die and coupled to the first and second through-body-vias, respectively, each stack conductor comprising; an interleaved stack of electrically conductive metal layers separated by insulation layers disposed at the front side of the die; and a plurality of conductive through-layer-vias in each insulation layer, each through-layer-via passing through an insulation layer and electrically coupling adjacent metal layers of the stack conductor; and a transformer having a core in the die body, said transformer including said first through-body-via based inductor and including a second through-body-via-based inductor in the die having first and second turns, wherein the first and second turns of the first and second through-body-via-based inductors are interwound so that the first and second through-body-via-based inductors are inductively coupled together and share the core in the die body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification