High temperature transponders

• US 9,673,516 B2
• Filed: 09/16/2013
• Issued: 06/06/2017
• Est. Priority Date: 09/14/2012
• Status: Active Grant

• Current Assignee: Magna Equities I, LLC
• Original Assignee: JAMM Technologies, Inc. (Establishment Labs Holdings, Inc.)
• Inventors: Mejia, Ezequiel
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Davis, Walter
• Application Number:
  US14/027,896
• Publication Number:
  US 20140078013A1
• Time in Patent Office: 1,359 Days
• Field of Search: 343788, 235492
• CPC Class Codes: G06K 7/10336 the antenna being of the near field type, inductive coil
• CPC Class Codes: H01Q 1/002 Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 7/06 with core of ferromagnetic material H01Q7/02 takes precedence

Abstract

The present invention provides, in alternative embodiments, high temperature transponders that can withstand high temperature shocks and can maintain their physical and electrical characteristics following high temperature exposure, and methods of making said transponders.

Claims

1. A high temperature transponder, comprising:

an antenna assembly, comprising;

a core comprising a first end portion, a second end portion, and a center portion between the first end portion and the second end portion, wherein each of the first end portion and the second end portion has a width greater than a width of the center portion;

an insulated antenna wire wound around the center portion of the core in a coil, the insulated antenna wire having a first wire end and a second wire end; and

an integrated circuit chip disposed on one of the first end portion or the second end portion, wherein two metal inlay portions are embedded within the chip, and wherein the first wire end and the second wire end are each connected to one of the two metal inlay portions by at least one of thermal compression, laser welding, crimp connection, soldering, or a connection adhesive;

a glass capsule enclosing the antenna assembly and defining a space between the glass capsule and the antenna assembly; and

a high temperature adhesive at least partially filling the space and covering at least 50% of the insulated antenna wire, wherein the adhesive is cured and fixes a position of the antenna assembly relative to the glass capsule.

2. The high temperature transponder of claim 1, wherein the antenna assembly, the glass capsule, and the high temperature adhesive of the high temperature transponder are together configured to withstand 4 to 8 hour cycles of temperatures of 165 to 195°

C.

3. The high temperature transponder of claim 1, wherein the insulated antenna wire is an enameled copper wire, and is wound uniformly around the center portion of the core from about 800 to about 1000 times.

4. The high temperature transponder of claim 1, wherein the integrated circuit chip comprises a complementary metal-oxide-semiconductor (CMOS) integrated circuit storing an identification code.

5. The high temperature transponder of claim 1, wherein the metal inlay portions comprise gold.

6. The high temperature transponder of claim 1, wherein the first wire end and the second wire end are each connected to one of the two metal inlay portions by thermal compression.

7. The high temperature transponder of claim 1, wherein the high temperature adhesive is a light-curing acrylate adhesive.

8. The high temperature transponder of claim 1, wherein the high temperature adhesive covers at least 75% of the insulated antenna wire.

9. The high temperature transponder of claim 1, wherein a surface of the integrated circuit chip includes an etched region into which the metal inlay portions are embedded.

15. The high temperature transponder of claim 1, wherein the core includes a first transition portion between the first end portion and the center portion, and a second transition portion between the second end portion and the center portion, and each of the first transition portion and the second transition portion has at least two curved sides so that a width of the respective transition portion gradually increases from the center portion to the respective end portion.

16. The high temperature transponder of claim 15, wherein the insulated antenna wire is not wound around the first end portion and second end portion of the core.

17. The high temperature transponder of claim 1, wherein a length of the core ranges from about 5 mm to about 20 mm.

18. The high temperature transponder of claim 1, wherein a length of the core is about 7 mm.

19. The high temperature transponder of claim 1, wherein a diameter of the insulated copper antenna wire ranges from about 0.10 mm to about 0.50 mm.

20. The high temperature transponder of claim 1, wherein the high temperature adhesive does not become brittle after heating and cooling.

10. A transponder comprising:

an assembly including;

a core comprising a first end portion, a second end portion, and a center portion between the first end portion and the second end portion, wherein each of the first end portion and the second end portion has a width greater than a width of the center portion;

an insulated wire coiled around the center portion of the core, the insulated wire having a first wire end and a second wire end; and

an integrated circuit chip coupled to the first wire end and the second wire end, wherein a surface of the integrated circuit chip includes at least two portions of a conductive material embedded into the surface;

a glass capsule enclosing the assembly and defining a space between the glass capsule and the assembly; and

an adhesive completely filling the space and completely covering the insulated wire, the adhesive maintaining a position of the assembly relative to the glass capsule.

11. The transponder of claim 10, wherein the at least two portions of the conductive material are embedded into an etched region of the surface, each of the first wire end and second wire end being connected to one of the at least two portions.

12. The transponder of claim 10, wherein the core comprises a Ni—

Zn ferrite material.

13. The transponder of claim 10, wherein the adhesive comprises a glue or epoxy material configured to withstand temperatures ranging from 180°

C. to 270°

C. without evaporating or expanding.

14. A transponder comprising:

an assembly including;

a core;

an insulated wire coiled around the core, the wire having a first end and a second end; and

an integrated circuit chip comprising at least two portions of a metal or metal alloy embedded into a surface of the integrated circuit chip, wherein the first and second ends of the wire are each connected to one of the at least two portions;

a glass capsule enclosing both the assembly and a space between the assembly and the glass capsule; and

a cured adhesive filling the space between the assembly and the glass capsule, wherein the adhesive maintains a position of the assembly relative to the capsule and withstands temperatures ranging from 180°

C. to 270°

C. without evaporating or expanding.

21. The transponder of claim 14, wherein the insulated wire is an enameled copper wire.