Sensor device packages and related fabrication methods

• US 9,676,611 B2
• Filed: 10/18/2013
• Issued: 06/13/2017
• Est. Priority Date: 10/18/2013
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Inventors: Hooper, Stephen R., Bowles, Philip H.
• Primary Examiner(s): Toledo, Fernando L
• Assistant Examiner(s): NGUYEN, LAWRENCE-LIN T
• Application Number:
  US14/057,262
• Publication Number:
  US 20150108653A1
• Time in Patent Office: 1,334 Days
• Field of Search: 361790
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

Sensor device packages and related fabrication methods are provided. An exemplary sensor device package includes a first structure having a sensing arrangement thereon, a second structure having circuitry thereon, and a conductive structure within the first structure and coupled to the circuitry to provide an electrical connection to the circuitry through the first structure. Thus, circuitry on the second structure may be electrically connected to an interface of the sensor device package through the first structure.

Claims

1. A sensor device comprising:

a first semiconductor die having a sensing arrangement fabricated thereon;

a second semiconductor die having circuitry fabricated thereon;

a conductive structure within the first semiconductor die and coupled to the circuitry to provide a first electrical connection between the sensing arrangement and the circuitry through the first semiconductor die;

a third structure coupled to a first side of the first semiconductor die to establish a sealed chamber having a fixed reference pressure on the first side of the sensing arrangement, the second semiconductor die being coupled to a second side of the first semiconductor die opposite the first side; and

a second conductive structure within the third structure and coupled to the conductive structure to provide a second electrical connection to the circuitry through the third structure.

2. The sensor device of claim 1, wherein the circuitry comprises control circuitry coupled to the sensing arrangement to determine a metric indicative of a sensed characteristic based on an electrical signal from the sensing arrangement.

3. The sensor device of claim 1, further comprising an interface coupled to the conductive structure, wherein the conductive structure provides the first electrical connection between the interface and the circuitry through the first semiconductor die.

4. The sensor device of claim 1, wherein:

the circuitry comprises an application specific integrated circuit to determine a metric indicative of a sensed characteristic based on an electrical signal from the sensing arrangement received via the conductive structure.

5. The sensor device of claim 1, further comprising:

a fourth structure coupled to the third structure to establish a second fixed reference pressure on the first side of a second sensing arrangement on the first semiconductor die; and

a third conductive structure within the fourth structure and coupled to the second conductive structure to provide the second electrical connection to the circuitry through the fourth structure.

6. The sensor device of claim 1, wherein the second semiconductor die is coupled to the first semiconductor die to establish a second fixed reference pressure for the sensing arrangement.

7. The sensor device of claim 1, further comprising:

a fourth structure having a second sensing arrangement thereon;

a third conductive structure within the fourth structure and coupled to the second sensing arrangement to provide a third electrical connection to the second sensing arrangement through the fourth structure; and

a support structure to provide a lateral electrical connection between the third conductive structure and the conductive structure.

8. The sensor device of claim 7, wherein the support structure comprises one or more redistribution layers.

9. The sensor device of claim 1, further comprising a third conductive structure within the second semiconductor die and coupled to the circuitry to provide the second electrical connection to the circuitry through the second semiconductor die.

10. The sensor device of claim 9, further comprising a fourth structure having a second sensing arrangement thereon, wherein the second conductive structure provides the second electrical connection between the second sensing arrangement and the circuitry.

11. The sensor device of claim 10, wherein:

the fourth structure overlies the second semiconductor die;

the second semiconductor die overlies the first semiconductor die; and

a molding compound overlies the first semiconductor die, the molding compound encapsulating the second semiconductor die and the fourth structure.

17. The sensor device of claim 1, wherein the second semiconductor die overlies the first semiconductor die.

18. The sensor device of claim 1, wherein:

the first semiconductor die overlies the third structure; and

the second semiconductor die overlies the first semiconductor die.

12. A sensor device package comprising:

a package interface;

a first sensor die overlying the package interface, the first sensor die having a first sensing arrangement thereon;

a first conductive structure within the first sensor die, the first conductive structure extending through the first sensor die and being coupled to the package interface to provide a first electrical connection through the first sensor die to the package interface;

a second die overlying the first sensor die, the second die having circuitry thereon, the circuitry being coupled to the first sensing arrangement to determine a metric indicative of a sensed characteristic based on one or more signals from the first sensing arrangement, wherein the circuitry is coupled to the first conductive structure to provide one or more output signals indicative of the metric to the package interface via the first electrical connection;

a third structure coupled to a first side of the first sensor die to establish a fixed reference pressure on the first side of the first sensing arrangement, the second die being coupled to a second side of the first sensor die opposite the first side; and

a second conductive structure within the third structure and coupled to the first conductive structure to provide a second electrical connection to the circuitry through the third structure.

13. The sensor device package of claim 12, further comprising:

a second package interface;

a second sensor die overlying the second die, the second sensor die having a second sensing arrangement thereon, wherein the circuitry is coupled to the second sensing arrangement to determine a second metric indicative of a second sensed characteristic based on signals from the second sensing arrangement; and

a third conductive structure within the first sensor die, the third conductive structure extending through the first sensor die and being coupled to the second package interface to provide a third electrical connection through the first sensor die to the second package interface, wherein the circuitry is coupled to the third conductive structure to provide one or more output signals indicative of the second metric to the second package interface via the third electrical connection.

14. The sensor device package of claim 12, further comprising:

a second sensor die, the first sensor die overlying the second sensor die, the second sensor die having a second sensing arrangement thereon; and

a third conductive structure within the first sensor die, the third conductive structure extending through the first sensor die, the third conductive structure being coupled to the circuitry and the second sensing arrangement to provide a third electrical connection through the first sensor die between the circuitry and the second sensing arrangement, wherein the circuitry is configured to determine a second metric indicative of a second sensed characteristic based on electrical signals from the second sensing arrangement received via the third electrical connection.

15. A method of fabricating a sensor device, the method comprising:

forming a conductive structure within a first semiconductor die and extending through the first semiconductor die, the first semiconductor die having a first sensing arrangement fabricated thereon;

bonding a third semiconductor die to the first semiconductor die to establish a sealed chamber having a reference pressure for the first sensing arrangement between the third semiconductor die and the first semiconductor die;

providing a first electrical connection between the conductive structure and an interface of the sensor device, wherein providing the first electrical connection comprises forming a second conductive structure within the third semiconductor die and extending through the third semiconductor die, the second conductive structure being coupled to the interface and the conductive structure;

providing a second electrical connection between the conductive structure and circuitry fabricated on a second semiconductor die, resulting in an electrical connection between the circuitry and the interface through the first semiconductor die.

16. The method of claim 15, further comprising forming a second conductive structure within the second semiconductor die and extending through the second semiconductor die, the second conductive structure being coupled to the circuitry, wherein providing the second electrical connection comprises providing the second electrical connection between the conductive structure and the second conductive structure.