Resin composition for sealing

• US 9,676,978 B2
• Filed: 07/15/2014
• Issued: 06/13/2017
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Ajinomoto Co., Inc.
• Original Assignee: Ajinomoto Company Limited (Ajinomoto Co., Inc.)
• Inventors: Kageyama, Yuichi
• Primary Examiner(s): KAUCHER, MARK S
• Application Number:
  US14/331,421
• Publication Number:
  US 20140323669A1
• Time in Patent Office: 1,064 Days
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 23/22 Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
• CPC Class Codes: C08L 53/005 Modified block copolymers
• CPC Class Codes: C08L 57/02 Copolymers of mineral oil hydrocarbons
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 91/00 Compositions of oils, fats or waxes; Compositions of derivatives thereof
• CPC Class Codes: C09K 2200/0617 Polyalkenes
• CPC Class Codes: C09K 2200/0632 Polystyrenes
• CPC Class Codes: C09K 3/1006 characterised by the chemical nature of one of its constituents
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A sealing resin composition simultaneously having good transparency, resistance to moisture permeability, and adhesiveness resistant to heat and humidity, and a sealing resin composition sheet obtained therefrom. Using a resin composition containing (A) a styrene-isobutylene modified resin and (B) a tackifier resin as a sealing resin composition, a resin composition layer composed of the resin composition may be formed on a support to give a sealing resin composition sheet.

Claims

1. A sealing resin composition, comprising:

(A) at least one styrene-isobutylene modified resin having an acid anhydride group concentration of 0.05 to 10 mmol/g, and at least one styrene-isobutylene modified resin having an epoxy group concentration of 0.05 to 10 mmol/g; and

(B) at least one tackifier resin.

2. A sealing resin composition according to claim 1, wherein the content of (A) is 35 to 80 mass % when the non-volatile component in the resin composition is 100 mass %.

3. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is an alicyclic petroleum resin.

4. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is an alicyclic saturated hydrocarbon resin and/or an alicyclic unsaturated hydrocarbon resin.

5. A sealing resin composition according to claim 1, wherein said (B) at least one tackifier resin is a cyclohexane ring-containing saturated hydrocarbon resin and/or a dicyclopentadiene-modified hydrocarbon resin.

6. A sealing resin composition according to claim 1, wherein the content of said (B) at least one tackifier resin is 5 to 60 mass % when the non-volatile component in the resin composition is 100 mass %.

7. A sealing resin composition according to claim 1, further comprising (C) at least one epoxy resin.

8. A sealing resin composition according to claim 1, further comprising (D) at least one curing agent.

9. A sealing resin composition according to claim 1, wherein a cured product of said resin composition, having a thickness of 40 μ

m, has a parallel light transmittance at 450 nm of 80 to 100%.

10. A sealing resin composition according to claim 1, wherein a cured product of said resin composition, having a thickness of 40 μ

m, has a moisture-vapor transmission of 1 to 40 g/m² in a period of 24 hours, and an adhesion strength after environment test of 10 to 50 N/25 mm.

11. A sealing resin composition sheet, comprising a sealing resin composition according to claim 1.

12. A sealing resin composition sheet according to claim 11, wherein said sealing resin composition is formed on a support.

13. A sealing resin composition sheet according to claim 11, which is adapted for sealing an organic electroluminescence (EL) element.

14. A method of sealing an organic EL element, comprising coating said organic EL element with a sealing resin composition according to claim 1.

15. A method of sealing an organic EL element, comprising laminating said organic EL element with a sealing resin composition sheet according to claim 12.

16. An organic EL device, comprising a sealing resin composition according to claim 1.

17. An organic EL device, which is prepared by a method according to claim 15.

18. A sealing resin composition according to claim 1, wherein the at least one styrene-isobutylene modified resin has an acid anhydride group concentration of 0.2 to 5 mmol/g, and the at least one styrene-isobutylene modified resin has an epoxy group concentration of 0.2 to 5 mmol/g.