Light emitting device having substrate including heat dissipation terminals

• US 9,680,071 B2
• Filed: 07/26/2016
• Issued: 06/13/2017
• Est. Priority Date: 05/21/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Nakabayashi, Takuya, Hori, Akira
• Primary Examiner(s): Pham, Hoai V
• Application Number:
  US15/219,627
• Publication Number:
  US 20160336494A1
• Time in Patent Office: 322 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

Claims

1. A light emitting device comprising:

a substrate having a first main surface,

a second main surface that is opposite the first main surface, and

a mounting surface that is adjacent to at least the second main surface, and

that includes

an insulating base material,

a pair of connection terminals disposed on the second main surface, and

a plurality of heat dissipation terminals disposed between the pair of connection terminals,

a light emitting element that is mounted on the first main surface of the substrate in flip-chip manner, and

a light blocking sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

2. The light emitting device according to claim 1, further comprising

an additional light emitting element.

3. The light emitting device according to claim 2, wherein

the heat dissipation terminals are respectively disposed at a position between the light emitting element and the additional light emitting element and at positions corresponding to the light emitting element and the additional light emitting element on a second main surface side.

4. The light emitting device according to claim 3, wherein

each of the heat dissipation terminals includes a concave component.

5. The light emitting device according to claim 4, wherein

a base member of the substrate is partially exposed on the second main surface of the substrate.

6. The light emitting device according to claim 5, wherein

each of the heat dissipation terminals includes an edge extending generally along a straight line.

7. The light emitting device according to claim 1, wherein

each of the heat dissipation terminals includes a concave component.

8. The light emitting device according to claim 1, wherein

each of the heat dissipation terminals includes a narrow part.

9. The light emitting device according to claim 1, wherein

each of the heat dissipation terminals includes a plurality of narrow parts and a concave component disposed between the narrow parts.

10. The light emitting device according to claim 1, further comprising

a solder resist disposed on the second main surface of the substrate.

11. The light emitting device according to claim 10, wherein

the solder resist defines a shape of each of the heat dissipation terminals.

12. The light emitting device according to claim 10, wherein

at least one of the heat dissipation terminals is defined as an exposed part of a metal film disposed on the second main surface of the substrate with the metal film being partially covered by the solder resist.

13. The light emitting device according to claim 1, wherein

the substrate has an elongated shape in a plan view.

14. The light emitting device according to claim 1, further comprising

an additional light emitting element,

each of the light emitting element and the additional light emitting element having an elongated shape, and the light emitting element and the additional light emitting element being aligned along a longitudinal direction of the substrate.

15. The light emitting device according to claim 14, wherein

the heat dissipation terminals are disposed on the second main surface of the substrate respectively at a position between the light emitting element and the additional light emitting element and at positions corresponding to the light emitting element and the additional light emitting element.

16. The light emitting device according to claim 1, wherein

a height of the heat dissipation terminals is shorter than a height of the connection terminals.

17. The light emitting device according to claim 1, wherein

the insulating base material is partially exposed on the second main surface of the substrate.

18. The light emitting device according to claim 1, wherein

each of the heat dissipation terminals includes an edge extending generally along a straight line.

19. The light emitting device according to claim 1, wherein

the connection terminals are respectively disposed at end portions of the substrate on the second main surface.

20. The light emitting device according to claim 1, wherein

at least one of the heat dissipation terminals extends to the first main surface of the substrate with a via.

21. The light emitting device according to claim 1, wherein

the light emitting element has a rectangular shape in a plan view with a length of a long side to a length of a short side being in a range about 2:

1 to 50;

1.