Capacitive grounding methods and apparatus for mobile devices

• US 9,680,212 B2
• Filed: 11/20/2013
• Issued: 06/13/2017
• Est. Priority Date: 11/20/2013
• Status: Active Grant

• Current Assignee: Pulse Finland Oy (Yageo Corporation)
• Original Assignee: Pulse Finland Oy (Yageo Corporation)
• Inventors: Konu, Jarmo, Ramachandran, Prasadh, Annamaa, Petteri
• Primary Examiner(s): Smith, Graham
• Application Number:
  US14/085,093
• Publication Number:
  US 20150138021A1
• Time in Patent Office: 1,301 Days
• Field of Search: 343702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Grounding apparatus for mobile devices and methods of utilizing and manufacturing the same. In one embodiment, an outer metallized surface of a mobile device is configured to capacitively couple a metal back cover to the device ground. Specifically, in one implementation, an exterior surface of the mobile device is metalized and coupled to the device ground via galvanic contacts. The exterior metalized surface is configured to be capacitively coupled a metal back cover of a mobile device to the device ground when the back cover is installed on the mobile device. By capacitively coupling the back cover to the device ground via the exterior metalized surface, the need to otherwise ground the back cover through the use of galvanic contacts is obviated, thereby reducing the number of components needed.

Claims

1. A mobile wireless device, comprising:

one or more antenna elements;

a main body portion, said main body portion comprising at least a metalized surface, at least a portion of said metalized surface being disposed on an external surface of said main body portion; and

a back cover portion, said back cover portion at least partly capacitively coupled to a device ground of said mobile wireless device via said metalized surface of said main body portion;

wherein said metalized surface is disposed between said back cover portion and said device ground, said metalized surface being galvanically coupled to said device ground.

2. The mobile wireless device of claim 1, wherein said at least metalized surface is connected to said device ground via one or more galvanic contacts.

3. The mobile wireless device of claim 1, wherein the main body portion comprises a middle deck, said middle deck comprising at least a portion of said one or more galvanic contacts.

4. The mobile wireless device of claim 2, wherein said capacitive coupling to said device ground is configured to reduce a number of galvanic contacts necessary to achieve substantially similar performance of at least one or said one or more antenna elements.

5. The mobile wireless device of claim 4, wherein said performance comprises a resonance frequency of said one or more antenna elements.

6. The mobile wireless device of claim 1, wherein performance of at least one of said one or more antenna elements is substantially independent from placement of said back cover portion on said mobile wireless device.

7. The mobile wireless device of claim 6, wherein said performance comprises a resonance frequency of said one or more antenna elements.

8. The mobile wireless device of claim 1, wherein performance of at least one of said one or more antenna elements is substantially independent from a construction material of said back cover portion.

9. The mobile wireless device of claim 1, wherein said at least metalized surface is formed on said main body portion using a laser direct structuring (LDS) process.

10. An antenna apparatus, comprising:

at least one radiator element comprising;

a feed point; and

a conductive element coupled to said feed point;

a dielectric substrate having a plurality of surfaces, said dielectric substrate comprising said least one radiator element and a metal surface; and

a ground plane coupled to a ground of a host device;

wherein said metal surface is configured to capacitively couple at least a portion of a back cover of said host device to said ground of said host device; and

wherein said dielectric substrate is disposed between at least said portion of said back cover and said metal surface, and at least a portion of said metal surface is disposed between said dielectric substrate and said ground plane.

11. The antenna apparatus of claim 10, wherein said metal surface comprises an outer surface that is coupled to said ground of said host device via one or more galvanic contacts.

12. The antenna apparatus of claim 11, wherein said dielectric substrate further comprises at least a portion of said one or more galvanic contacts.

13. The antenna apparatus of claim 10, wherein said metal surface is configured so that performance of said at least one radiator element is substantially independent of said back cover.

14. The antenna apparatus of claim 13, wherein said performance comprises a resonance frequency of said at least one radiator element.

15. The antenna apparatus of claim 10, wherein said capacitive coupling is configured to reduce a number of galvanic contacts necessary to achieve substantially similar performance of said at least one radiator element.

16. The antenna apparatus of claim 15, wherein said performance comprises a resonance frequency of said at least one radiator element.

17. A method for grounding one or more components of a mobile wireless device, said method comprising:

metalizing at least an exterior portion of a main body of said mobile wireless device;

connecting said metalized exterior portion to a ground of said mobile wireless device using at least one galvanic contact; and

disposing a back cover over said metalized exterior portion of said main body to achieve capacitive coupling of at least a portion of said back cover of said mobile wireless device to said metalized exterior portion, said capacitive coupling configured to ground said metalized exterior portion to said ground of said mobile wireless device.

18. The method of claim 17, further comprising forming said at least one galvanic contact by metalizing an interior portion of said main body.

19. The method of claim 17, wherein said capacitive coupling is configured to reduce a number of galvanic contacts otherwise required to achieve a performance of grounding of said back cover to said ground of said mobile wireless device.