Packaged device including cavity package with elastic layer within molding compound

• US 9,680,445 B2
• Filed: 10/31/2014
• Issued: 06/13/2017
• Est. Priority Date: 10/31/2014
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Oppermann, Klaus-Guenter, Barfknecht, Andrew Thomas
• Primary Examiner(s): DOUGHERTY, THOMAS M
• Application Number:
  US14/529,394
• Publication Number:
  US 20160126443A1
• Time in Patent Office: 956 Days
• Field of Search: 310340, 310344, 310348, 174521
• CPC Class Codes: H03H 9/0523 for flip-chip mounting
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1014 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.

Claims

1. A device, comprising:

a substrate;

a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit, the cavity package being hermetically sealed;

an elastic layer formed on a second surface of the cavity package, opposite the first surface; and

a molding compound formed on the substrate, encasing the cavity package and the elastic layer,

wherein the elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, at least for maintaining structural integrity of the cavity package, and

wherein a Young'"'"'s modulus of the elastic layer is lower than a Young'"'"'s modulus of the molding compound.

2. The device of claim 1, wherein the elastic layer comprises one of a polyimide material or a silicone elastomer material.

3. The device of claim 1, wherein the substrate comprises a laminate printed circuit board (PCB), and the first surface of the cavity package is attached to the laminate PCB via a plurality of solder joints.

4. The device of claim 1, wherein the cavity package comprises a base substrate, a lid and a seal-ring between the base substrate and the lid for bonding the base substrate and the lid.

5. The device of claim 4, wherein the electronic circuit is positioned in a cavity formed, at least in part, by an internal separation between the base substrate and the lid resulting from the seal-ring, and the seal-ring hermetically seals the electronic circuit positioned in the cavity.

6. The device of claim 5, wherein the cavity package further comprises a via formed through one of the lid and the base substrate, and a via seal surrounding a base of the via inside the cavity, the via seal further hermetically sealing the electronic circuit positioned in the cavity, and

wherein the via enables at least electrical connections between the electronic circuit and traces on the substrate.

7. The device of claim 6, wherein the electronic circuit comprises a plurality of resonators.

8. The device of claim 7, wherein the plurality of resonators comprise thin film bulk acoustic resonators (FBARs), solidly mounted resonators (SMRs), or surface acoustic wave (SAW) resonators.

9. The device of claim 3, further comprising:

another elastic layer formed between the cavity package and the substrate in an area of the plurality of solder joints.

10. A microcap die, comprising:

a base substrate;

a plurality of acoustic resonators attached to an inner surface of the base substrate;

a lid disposed over the base substrate;

a seal-ring disposed between the inner surface of the base substrate and an inner surface of the lid, and surrounding the plurality of acoustic resonators, the seal-ring forming a cavity between the inner surface of the lid and the inner surface of the base substrate containing the plurality of acoustic resonators, wherein the seal-ring provides a hermetic seal for the cavity;

an elastic layer formed on one of an outer surface of the lid or an outer surface of the base substrate; and

a molding compound formed over the base substrate, the seal-ring, the lid and the elastic layer,

wherein the elastic layer reduces stress between the molding compound and at least the seal-ring for maintaining the hermetic seal, and

wherein a Young'"'"'s modulus of the elastic layer is lower than a Young'"'"'s modulus of the molding compound.

11. The microcap die of claim 10, further comprising:

a conductive via formed through one of the base substrate and the lid to enable an electrical connection between the plurality of acoustic resonators outside the cavity; and

a via seal surrounding a base of the conductive via inside the cavity, the via seal providing a further hermetic seal for the cavity.

12. The microcap die of claim 10, wherein the one of the outer surface of the lid or the outer surface of the base substrate is electrically and mechanically attached to a printed circuit board (PCB) via a plurality of solder joints.

13. The microcap die of claim 10, wherein vertical surface traction force applied by the molding compound to the microcap die is inversely proportional to a thickness of the elastic layer.

14. The microcap die of claim 10, wherein the elastic layer is formed of a compliant material applied as a dry film.

15. The microcap die of claim 10, wherein the elastic layer is formed of a compliant material cast from a solution.

16. The microcap die of claim 10, wherein the elastic layer is formed of a compliant material applied by dispensing as a liquid.

17. A device, comprising:

a substrate;

a hermetically sealed cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit;

an elastic layer formed on a second surface of the cavity package, opposite the first surface; and

a molding compound formed on the substrate, encasing the cavity package and the elastic layer,

wherein the elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, at least for maintaining structural integrity of the cavity package, and

wherein the cavity package comprises;

a base substrate;

a lid;

a seal-ring between the base substrate and the lid for bonding the base substrate and the lid, wherein the electronic circuit is positioned in a cavity formed, at least in part, by an internal separation between the base substrate and the lid resulting from the seal-ring;

a via formed through one of the lid and the base substrate;

a via seal surrounding a base of the via inside the cavity, the via seal further hermetically sealing the electronic circuit positioned in the cavity,

wherein the via enables at least electrical connections between the electronic circuit and traces on the substrate, and wherein the via seal comprises a pedestal, which provides separation between the lid and the base wafer, and two metal layers on the pedestal, the two metal layers being joined to each other to provide the at least electrical connections.