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Packaged device including cavity package with elastic layer within molding compound

  • US 9,680,445 B2
  • Filed: 10/31/2014
  • Issued: 06/13/2017
  • Est. Priority Date: 10/31/2014
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a substrate;

    a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit, the cavity package being hermetically sealed;

    an elastic layer formed on a second surface of the cavity package, opposite the first surface; and

    a molding compound formed on the substrate, encasing the cavity package and the elastic layer,wherein the elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, at least for maintaining structural integrity of the cavity package, andwherein a Young'"'"'s modulus of the elastic layer is lower than a Young'"'"'s modulus of the molding compound.

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