Ceramic multilayer substrate

• US 9,681,534 B2
• Filed: 08/26/2013
• Issued: 06/13/2017
• Est. Priority Date: 03/25/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Otsubo, Yoshihito
• Primary Examiner(s): Lee, Pete
• Application Number:
  US13/975,568
• Publication Number:
  US 20130341080A1
• Time in Patent Office: 1,387 Days
• Field of Search: 257734-786, 174260-262, 361760, 361777, 361792-795
• CPC Class Codes: H05K 1/0213 Electrical arrangements not otherwise provided for
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

In a ceramic multilayer substrate including a ceramic laminate including ceramic layers, a surface electrode located on a surface of the ceramic laminate, and a cover ceramic layer that covers a peripheral portion of the surface electrode, a recess portion is provided in a peripheral portion of a surface electrode to extend along the periphery thereof, and the peripheral portion of the surface electrode includes a peripheral end portion thereof and a region in which the recess portion is covered with a cover ceramic layer. A height of a central portion of the surface electrode which is not covered with the cover ceramic layer is lower than a height of a primary surface of the ceramic laminate on which the surface electrode is located.

Claims

1. A ceramic multilayer substrate comprising:

a ceramic laminate including first and second primary surfaces opposed to each other and ceramic layers laminated to each other and a surface electrode located on a portion of the first primary surface of the ceramic laminate;

a cover ceramic layer arranged to cover a peripheral portion of the surface electrode wherein a recess portion is provided in a region of the surface electrode spaced inward from a peripheral end portion of the surface electrode;

the recess portion is substantially V shaped;

the surface electrode includes a first surface adjacent to the first primary surface of the ceramic laminate and a second surface opposed to the first surface and spaced away from the first primary surface of the ceramic laminate;

a height between the second surface of the surface electrode in the recess portion and the second primary surface of the ceramic laminate is less than a height between the second surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate; and

a height between the first surface of the surface electrode in the recess portion and the second primary surface of the ceramic laminate is less than a height between the first surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate, the height between the first surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate is less than or equal to a height between the first primary surface and the second primary surface of the ceramic laminate and wherein the cover ceramic layer is disposed in the recess portion of the surface electrode and the cover ceramic layer includes a V-shaped groove and an outermost surface wherein the outermost surface of the cover ceramic layer is flush with the first primary surface of the ceramic laminate.

2. The ceramic multilayer substrate according to claim 1, wherein the recess portion extends along a periphery of the surface electrode.

3. The ceramic multilayer substrate according to claim 1, wherein at least a portion of the surface electrode is provided in the first primary surface of the ceramic laminate.

4. The ceramic multilayer substrate according to claim 1, further comprising a plating film located on at least a portion of the second surface of the surface electrode.

5. The ceramic multilayer substrate according to claim 1, further comprising another recess portion provided in another portion of the surface electrode.

6. A ceramic multilayer substrate comprising:

a ceramic laminate including first and second primary surfaces opposed to each other and ceramic layers laminated to each other; and

a surface electrode located on a portion of the first primary surface of the ceramic laminate; and

a cover ceramic layer arranged to cover a peripheral portion of the surface electrode;

wherein a recess portion is provided in a region spaced inward from a peripheral end portion of the surface electrode;

the recess portion is substantially V shaped;

a height of a peripheral portion of the surface electrode is higher than a height between a central portion of the surface electrode;

the surface electrode includes a first surface adjacent to the first primary surface of the ceramic laminate and a second surface opposed to the first surface and spaced away from the first primary surface of the ceramic laminate;

a height of a central portion of the second surface of the surface electrode and the second primary surface of the ceramic laminate is less than a height between the first primary surface of the ceramic laminate and the second primary surface of the ceramic laminate; and

a height between the first surface of the surface electrode in the peripheral portion and the second primary surface of the ceramic laminate is less than a height between the first surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate, the height between the first surface of the surface electrode at the peripheral end portion measured from the second primary surface of the ceramic laminate is less than or equal to a height between the first primary surface and the second primary surface of the ceramic laminate and wherein the cover ceramic layer is disposed in the recess portion of the surface electrode and the cover ceramic layer includes a groove and an outermost surface wherein the outermost surface of the cover ceramic layer is flush with the first primary surface of the ceramic laminate.

7. The ceramic multilayer substrate according to claim 6, wherein at least a portion of the surface electrode is provided in the first primary surface of the ceramic laminate.

8. The ceramic multilayer substrate according to claim 6, further comprising a plating film located on at least a portion of the second surface of the surface electrode.

9. The ceramic multilayer substrate according to claim 6, wherein the recess portion extends along a periphery of the surface electrode.

10. The ceramic multilayer substrate according to claim 6, further comprising another recess portion provided in another portion of the surface electrode.

11. The ceramic multilayer substrate according to claim 6 wherein at least a portion of the surface electrode is provided in the first primary surface of the ceramic laminate.

12. A ceramic multilayer substrate comprising:

a ceramic laminate including first and second primary surfaces opposed to each other and ceramic layers laminated to each other;

a surface electrode located on a portion of the first primary surface of the ceramic laminate; and

a cover ceramic layer arranged to cover a peripheral portion of the surface electrode;

wherein a recess portion is located in the peripheral portion of the surface electrode;

the recess portion is substantially V shaped;

the peripheral portion of the surface electrode includes a peripheral end portion and a region in which the recess portion is covered with the cover ceramic layer;

the surface electrode includes a first surface adjacent to the first primary surface of the ceramic laminate and a second surface opposed to the first surface and spaced away from the first primary surface of the ceramic laminate;

a height between a central portion of the second surface of the surface electrode and the second primary surface of the ceramic laminate is less than a height between the first primary surface of the ceramic laminate and the second primary surface of the ceramic laminate; and

a height between the first surface of the surface electrode in the recess portion and the second primary surface of the ceramic laminate is less than a height between the first surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate, the height between the first surface of the surface electrode at the peripheral end portion and the second primary surface of the ceramic laminate is less than or equal to the height between the first primary surface and the second primary surface of the ceramic laminate and wherein the cover ceramic layer is disposed in the recess portion of the surface electrode and the cover ceramic layer includes a groove and an outermost surface and wherein the outermost surface of the cover ceramic layer is flush with the first primary surface of the ceramic laminate.

13. The ceramic multilayer substrate according to claim 12, wherein the recess portion extends along a periphery of the surface electrode.

14. The ceramic multilayer substrate according to claim 12, wherein at least a portion of the surface electrode is provided in the first primary surface of the ceramic laminate.

15. The ceramic multilayer substrate according to claim 12, further comprising a plating film located on at least a portion of the second surface of the surface electrode.

16. The ceramic multilayer substrate according to claim 12, wherein the recess portion is provided in a region spaced inward from a peripheral end portion of the surface electrode.

17. The ceramic multilayer substrate according to claim 12, further comprising another recess portion provided in another portion of the surface electrode.