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Module with integrated power electronic circuitry and logic circuitry

  • US 9,681,558 B2
  • Filed: 08/12/2014
  • Issued: 06/13/2017
  • Est. Priority Date: 08/12/2014
  • Status: Active Grant
First Claim
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1. An integrated power module with integrated power electronic circuitry and logic circuitry, comprising:

  • a first lamination substrate comprising a dielectric material laminated with a metal foil;

    an embedded power semiconductor module on the first lamination substrate and including one or more power semiconductor dies embedded in a dielectric material;

    a multi-layer logic printed circuit board (PCB) core on the first lamination substrate and spaced apart from the embedded power semiconductor module;

    a second lamination substrate comprising a dielectric material laminated with a metal foil, the second lamination substrate covering the embedded power semiconductor module and the multi-layer logic PCB core;

    a recess formed in a dielectric-filled gap between the power semiconductor module and the multi-layer logic PCB core, the recess extending through the second lamination substrate and the dielectric-filled gap to or into the first lamination substrate; and

    a flexible connection integrally formed between the embedded power semiconductor module and the multi-layer logic PCB core, the flexible connection mechanically connecting the embedded power semiconductor module to the multi-layer logic PCB core and providing an electrical pathway between the embedded power semiconductor module and the multi-layer logic PCB core, the flexible connection formed from a region of the first lamination substrate exposed by the recess.

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