Insert molded parts and methods for forming the same

• US 9,682,500 B2
• Filed: 12/16/2013
• Issued: 06/20/2017
• Est. Priority Date: 09/30/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Stanley, Craig M.
• Primary Examiner(s): WARREN, DAVID S
• Application Number:
  US14/108,148
• Publication Number:
  US 20150092365A1
• Time in Patent Office: 1,282 Days
• Field of Search: 361752, 264255
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/1635 using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

The embodiments described herein relate to insert molding methods. The methods involve partially or fully encasing an insert within a thermoplastic material, forming a composite part that includes the insert and the molded thermoplastic material. Methods described provide a number of improvements over traditional insert molding techniques. In specific embodiments, a two-shot molding process is used whereby a first shot is formed on a first portion of the insert and a second shot is formed on a second portion of the insert. The insert molding processes can be performed using a single mold during the first and second injection molding processes.

Claims

1. A method for forming a composite part having an insert and a molded piece, the method comprising:

securing the insert within a mold using a support mold, the insert having a first surface area and a second surface area, wherein the support mold covers the second surface area;

forming a first portion of the molded piece on the first surface area by injecting a first resinous material into the mold and onto the first surface area;

removing the support mold from the insert, thereby exposing the second surface area of the insert via a recess within the first portion; and

forming a second portion of the molded piece by injecting a second resinous material through a gate portion of the mold into the recess and onto the second surface area, wherein the gate portion forms an indentation within molded piece.

2. The method as recited in claim 1, wherein the first portion of the molded piece and the second portion of the molded piece are composed of the same thermoplastic material.

3. The method as recited in claim 1, wherein forming the first and second portions of the molded piece comprises partially encasing the insert within the molded piece.

4. The method as recited in claim 1, wherein forming the first and second portions of the molded piece comprises substantially fully encasing the insert within the molded piece.

5. The method as recited in claim 1, wherein injecting the first resinous material comprises injecting the first resinous material through a first runner system and injecting the second resinous material comprises injecting the second resinous material through a second runner system, wherein the first runner system is different than the second runner system.

6. The method as recited in claim 1, wherein the mold includes more than one gate portion such that more than one indentation is formed within the molded piece.

7. The method as recited in claim 1, wherein forming the first portion and the second portion involves forming a watertight barrier between at least a portion of the insert and an outer environment.

8. A composite part, comprising:

an insert having a first surface area and a second surface area; and

a molded piece formed using an injection molding process, the molded piece comprising;

a first portion disposed on the first surface area of the insert, the first portion including a recess that provides access to the second surface area of the insert,

a second portion disposed on the second surface area of the insert by way of the recess, and

an indentation disposed within the first portion, the indentation formed during the injection molding process.

9. The composite part as recited in claim 8, wherein the first portion and the second portion comprise the same thermoplastic material.

10. The composite part as recited in claim 8, wherein the insert is partially encased within the molded piece.

11. The composite part as recited in claim 8, wherein the insert is substantially fully encased within the molded piece.

12. The composite part as recited in claim 8, wherein the composite part is part of an electronic device.

13. The composite part as recited in claim 8, wherein the insert is an electronic component.

14. The composite part as recited in claim 13, wherein the electronic component is a printed circuit board.

15. The composite part as recited in claim 8, wherein the first portion and the second portion create a watertight barrier between at least a portion of the insert and an outer environment.

16. The composite part as recited in claim 8, wherein the composite part includes two indentations formed during the injection molding process.

17. An electronic device, comprising:

a printed circuit board having a first surface area and a second surface area; and

a molded piece at least partially encasing the printed circuit board therein, the molded piece formed using an injection molding process, the molded piece comprising;

a first portion disposed on the first surface area, the first portion including a recess that provides access to the second surface area of the printed circuit board,

a second portion disposed on the second surface area via the recess, and

an indentation disposed within the molded piece, the indentation formed during the injection molding process.

18. The electronic device as recited in claim 17, wherein the first portion and the second portion comprise the same material.

19. The electronic device as recited in claim 17, wherein the molded piece creates a watertight barrier between at least a portion of the printed circuit board and an outer environment.

20. The electronic device as recited in claim 17, wherein the indentation is proximate to the second portion.