Chip capacitor, circuit assembly, and electronic device

• US 9,685,273 B2
• Filed: 02/23/2016
• Issued: 06/20/2017
• Est. Priority Date: 11/02/2012
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Yamamoto, Hiroki, Tamagawa, Hiroshi, Watanabe, Keishi
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US15/051,648
• Publication Number:
  US 20160211077A1
• Time in Patent Office: 483 Days
• CPC Class Codes: H01G 2/06 specially adapted for mounting on a printed-circuit support
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 27/0629 in combination with diodes, or resistors, or capacitors
• CPC Class Codes: H01L 27/0676 : comprising combinations of diodes, or capacitors or resistors
• CPC Class Codes: H01L 28/40 : Capacitors
• CPC Class Codes: H01L 29/66189 : with PN junction, e.g. hybrid capacitors
• CPC Class Codes: H01L 29/94 : Metal-insulator-semiconductors, e.g. MOS
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10045 : Mounted network component having plural terminals
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H10B 41/00 : Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
• CPC Class Codes: H10B 63/20 : comprising selection components having two electrodes, e.g. diodes
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Claims

1. A chip part comprising

a substrate having an element forming surface and having a first region and a second region, the first region and the second region being apart from each other in a plan view of the element forming surface,

a composite element including a first element and a second element that are formed mutually independently on the element forming surface and having external connection electrodes constituted of the two electrodes of a first external connection electrode and a second external connection electrode,

a first internal electrode and a second internal electrode formed as one and another pole of the first element,

a third internal electrode and a fourth internal electrode formed as one and another pole of the second element, and

wherein the first external connection electrode is connected in common to the first internal electrode and the third internal electrode,

the second external connection electrode is connected in common to the second internal electrode and the fourth internal electrode,

the first internal electrode and the third internal electrode are disposed within an inner area surrounded by a periphery of the first external connection electrode in the plan view in the first region such that the first internal electrode and the third internal electrode are adjacent to each other, and

the second internal electrode and the fourth internal electrode are disposed within an inner area surrounded by a periphery of the second external connection electrode in the plan view in the second region such that the second internal electrode and the fourth internal electrode are adjacent to each other.

2. The chip part according to claim 1, further comprising an insulating film formed so as to cover the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode and having pad openings formed therein to expose portions of the first to fourth internal electrodes as pads, and

wherein the first external connection electrode and the second external connection electrode extend across the insulating film and enter into the respective pad openings.

3. The chip part according to claim 2, wherein a distance between the pad openings of the first and third internal electrodes and/or a distance between the pad openings of the second and fourth internal electrodes are or is 7 μ

m to 10 μ

m.

4. The chip part according to claim 1, wherein the first element includes a resistor portion, formed of a thin film resistor body formed on the substrate, and a wiring film connected to the resistor portion, and

portions of the wiring film form the first and second internal electrodes.

5. The chip part according to claim 4, wherein portions of the thin film resistor body and the wiring film are used as a fuse element.

6. The chip part according to claim 1, wherein the second element includes a plurality of diode cells, each having a diode junction region formed in the substrate, a first lead-out electrode connected to poles at one side of the diode cells, and a second lead-out electrode connected to poles at another side of the diode cells,

a portion of the first lead-out electrode forms the third internal electrode and a portion of the second lead-out electrode forms the fourth internal electrode.

7. The chip part according to claim 6, wherein each diode junction region is a pn junction region.

8. The chip part according to claim 7, wherein the substrate is constituted of a p-type semiconductor substrate, an n-type diffusion layer, forming the pn junction region in conjunction with the p-type semiconductor substrate, is formed in the p-type semiconductor substrate,

the second lead-out electrode is electrically connected to the semiconductor substrate, and

the first lead-out electrode contacts the n-type diffusion layer.

9. The chip part according to claim 8, wherein the second lead-out electrode includes an electrode film that contacts the p-type semiconductor substrate and is formed of AlSi.

10. The chip part according to claim 1, wherein each of the first external connection electrode and the second external connection electrode includes an Ni layer and an Au layer and the Au layer is exposed at the uppermost surface.

11. The chip part according to claim 10, wherein each of the first external connection electrode and second external connection electrode further includes a Pd layer interposed between the Ni layer and the Au layer.

12. The chip part according to claim 1, wherein the element forming surface of the substrate has a rectangular shape with rounded corner portions.

13. The chip part according to claim 12, wherein a recess is formed in a middle portion of at least one side of the rectangular shape.

14. A circuit assembly comprising

a mounting substrate and

the chip part according to claim 1 mounted on the mounting substrate.

15. The circuit assembly according to claim 14, wherein the chip part is connected to the mounting substrate by wireless bonding.

16. An electronic device comprising

the circuit assembly according to claim 14 and

a casing housing the circuit assembly.