Methods for making optical components, optical components, and products including same

• US 9,685,628 B2
• Filed: 08/16/2014
• Issued: 06/20/2017
• Est. Priority Date: 08/16/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Dan, Budhadipta, Coe-Sullivan, Seth
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US14/461,384
• Publication Number:
  US 20150048403A1
• Time in Patent Office: 1,039 Days
• Field of Search: None
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 71/851 Division of substrate
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential

Abstract

Methods for making multiple hermetically sealed optical components are disclosed. Methods for making an individual hermetically sealed optical component are disclosed. An individual hermetically sealed optical component and products including same are also disclosed.

Claims

1. A method for making multiple hermetically sealed optical components, the method comprising:

providing a first substrate including a surface including a patterned arrangement including two or more discrete regions including an optical material comprising a luminescent material, wherein each discrete region has a perimeter, wherein an hermetic sealing material is disposed on the surface of the substrate located around the perimeter of each of the discrete regions;

providing a second substrate over the surface of the first substrate including the patterned arrangement of discrete regions and sealing material forming an assembly;

sealing the sealing material between the first and second substrates to form an assembly of multiple hermetically sealed optical components; and

separating the assembly of multiple hermetically sealed optical components into individual hermetically sealed optical components.

2. A method in accordance with claim 1 wherein the disposing step and sealing step are carried out in the absence of oxygen.

3. A method in accordance with claim 1 wherein the two or more discrete regions in a preselected arrangement comprise recessed areas in the surface of the first substrate.

4. A method in accordance with claim 3 wherein the sealing material is included on an area of the surface of the first substrate that is not recessed.

5. A method in accordance with claim 1 wherein there is a gap between the sealing material that surrounds the perimeter of adjacent discrete regions.

6. A method in accordance with claim 5 further comprising cutting the sealed assembly through the gap between adjacent discrete regions to provide individual sealed optical components.

7. A method in accordance with claim 1 wherein the surface of the first substrate includes a recessed channel between adjacent discrete regions of the preselected arrangement.

8. A method in accordance with claim 7 further comprising cutting the sealed assembly through the recessed channels between adjacent recessed areas to provide individual sealed optical components.

9. A method in accordance with claim 1 wherein an individual sealed optical component includes a major surface with at least one dimension in a range from about 1 mm to about 100 mm.

10. A method in accordance with claim 1 wherein an individual sealed optical component is sealed by a border seal of sealing material therebetween.

11. A method in accordance with claim 10 wherein the border seal has a width of about 0.02 to about 2 mm measured from the edge of the optical component.

12. A method in accordance with claim 1 wherein the luminescent material comprises inorganic semiconductor nanocrystals.

13. A method in accordance with claim 1 wherein the luminescent material comprises an inorganic phosphor.

14. A method in accordance with claim 1 wherein the optical material comprises a UV curable composition including the luminescent material.

15. A method in accordance with claim 1 wherein the individual optical components are hermetically sealed.

16. An hermetically sealed planar optical component made by a method in accordance with claim 1.

17. An hermetically sealed planar optical component in accordance with claim 16 wherein the luminescent material comprises semiconductor nanocrystals.

18. An hermetically sealed planar optical component in accordance with claim 16 wherein the luminescent material comprises an inorganic phosphor.

19. A light emitting device including a light emitting component and a color conversion component comprising an hermetically sealed planar optical component in accordance with claim 16 in optical communication with light emitted by the light emitting component.

20. A light emitting device in accordance with claim 19 wherein there is a gap between the light emitting component and the optical component.