Apparatus and method for a conductive elastomer on a coaxial cable or a microcable to improve signal integrity probing

• US 9,685,717 B2
• Filed: 10/13/2014
• Issued: 06/20/2017
• Est. Priority Date: 03/14/2012
• Status: Active Grant

• Current Assignee: R&D Sockets Incorporated
• Original Assignee: R&D Sockets Incorporated
• Inventors: Warwick, Thomas P., Russell, James V.
• Primary Examiner(s): Estrada, Angel R
• Assistant Examiner(s): LEE, PETE T
• Application Number:
  US14/512,705
• Publication Number:
  US 20150027749A1
• Time in Patent Office: 981 Days
• Field of Search: 174255-266, 32475501
• CPC Class Codes: H01R 11/18 End pieces terminating in a probe
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 2201/20 for testing or measuring purposes
• CPC Class Codes: H01R 9/05 for coaxial cables
• CPC Class Codes: Y10T 29/49123 Co-axial cable
• CPC Class Codes: Y10T 29/49895 Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]

Abstract

A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable to improve signal integrity probing.

Claims

1. A method for improving signal integrity probing, the steps comprising:

threading one or more coaxial cables or microcoaxial cables through one or more optional alignment substrates, respectively wherein said one or more optional alignment substrates support or align the one or more cable or an array of cables;

separately placing a first grounding pin connected to a ground layer having its own conductive elastomeric coating thereon, said grounding pin being affixed on top of one of one or more an electrically conductive disc formed as a metallic disc isolated from other pins having conductive elastomeric coatings thereon and separately placing a central coaxial conductive pin having a conductive elastomeric coating thereon, said central coaxial pin being affixed on top of one of one or more said electrically conductive discs formed as a metallic disc, said central coaxial conductive pin being isolated from other pins having conductive elastomeric coatings thereon and separately placing another of said grounding pins connected to the ground layer having its own conductive elastomeric coating thereon and improving signal integrity probing by separately placing at least one or more one conductive elastomeric pin to be affixed on top of one or more electrically conductive discs formed as metallic discs isolated from another of said conductive elastomeric pins placed on another of said metallic discs so that each of said conductive elastomeric pins are is placed in fixed contact with at least one of a center conductive region of said one or more cables or said microcoaxial cables so that by isolating said conductive elastomeric regions from each other it prevents electrical shorting and improves signal integrity probing.

2. The method for improving signal integrity probing according to claim 1 further comprising forming a pad with a low contact resistance metal, said pad having sharp points or “

aspirates”

formed on top to help penetrate oxides, oils of debris that may form on the subject contact point that is intended to be probed.

3. The method according to claim 2 further comprising forming another pad with a low contact resistance metal having sharp points or “

aspirates”

formed on a bottom side of said substrate to provide for a high speed, high band width connector.

4. An apparatus for improving signal integrity probing, comprising:

one or more coaxial cables or microcoaxial cables threaded through one or more optional alignment substrates, respectively wherein said optional alignment substrates support or align the one or more cable or an array of cables;

separately placing a first grounding pin connected to a ground layer having its own conductive elastomeric coating thereon, said grounding pin being affixed on top of one of one or more an electrically conductive disc formed as a metallic disc isolated from other pins having conductive elastomeric coatings thereon and separately placing a central coaxial conductive pin having a conductive elastomeric coating thereon, said central coaxial pin being affixed on top of one of one or more said electrically conductive discs formed as a metallic disc, said central coaxial conductive pin being isolated from other pins having conductive elastomeric coatings thereon and separately placing another of said grounding pins connected to the ground layer having its own conductive elastomeric coating thereon and separately placing one or more conductive elastomeric pins separately placed for affixing on top of one or more electrically conductive discs formed as a metallic disc isolated from another of said conductive elastomeric pins placed on another said metallic discs so that each of said conductive elastomeric pins are in fixed contact with at least one of a center conductive region of said one or more cables or said microcoaxial cables so that by isolating said conductive elastomeric regions from each other it prevents electrical shorting and improves signal integrity probing.

5. The apparatus for improving signal integrity probing according to claim 4 wherein said conductive elastomeric coating is placed near a top surface of said substrate.

6. The apparatus for improving signal integrity probing according to claim 4 wherein said conductive elastomeric coating is applied to the center conductor region in a column.

7. The apparatus for improving signal integrity probing according to claim 6 said conductive elastomeric coating is applied in a ground shielding region where the shield of the cable and the top surface of the optional alignment substrate meet.

8. The apparatus for improving signal integrity probing according to claim 4 wherein said optional alignment substrate is formed as an electrically conductive metal.

9. The apparatus for improving signal integrity probing according to claim 4 wherein said optional alignment substrate is formed as an insulator.

10. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has an outer metallic shell that is placed firmly in intimate contact with said optional alignment substrate to ensure good electrical connection.

11. The apparatus for improving signal integrity probing according to claim 7 wherein said outer metallic shell is soldered to said optional alignment substrate to ensure good electrical connection.

12. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a top side that is flush with a top of said optional alignment substrate.

13. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a bottom side of the cable that is flush to the bottom side and is free to accept a traditional connector.

14. The apparatus for improving signal integrity probing according to claim 4 wherein said cable has a bottom that extends outward and can be free to accept a traditional connector.

15. The apparatus for improving signal integrity probing according to claim 4 further comprising low contact resistance metal forms a pad with sharp points or “

aspirates”

formed on top to help penetrate oxides, oils of debris that may form on the subject contact point that is intended to be probed.

16. The apparatus for improving signal integrity probing according to claim 15 wherein a low contact resistance metal forms another pad with sharp points or “

aspirates”

formed on a bottom side of said substrate to provide for a high speed, high band width connector.

17. A method for improving signal integrity probing, the steps comprising:

threading one or more coaxial cables or microcoaxial cables through one or more optional alignment substrates, respectively wherein said one or more optional alignment substrates support or align the one or more cable or an array of cables; and

improving signal integrity probing by separately placing a first grounding pin connected to a ground layer having its own conductive elastomeric coating thereon, said grounding pin being affixed on top of one of one or more an electrically conductive disc formed as a metallic disc isolated from other pins having conductive elastomeric coatings thereon and separately placing a central coaxial conductive pin having a conductive elastomeric coating thereon, said central coaxial conductive pin being affixed on top of one or more said electrically conductive discs each of which are formed as a metallic disc, said central coaxial conductive pin being isolated from other pins having conductive elastomeric coatings thereon and separately placing another of said grounding pins connected to the ground layer having its own conductive elastomeric coating thereon, said grounding pin being affixed on top of one of one or more an electrically conductive disc formed as a metallic disc isolated from other pins having conductive elastomeric coatings thereon so that each of said grounding and central coaxial conductive elastomeric pins are placed in fixed contact with at least one of a center conductive region of said one or more cables cable or said microcoaxial cables so that by isolating said conductive elastomeric coating regions from each other it prevents electrical shorting and improves signal integrity probing.

18. A method for improving signal integrity probing, the steps comprising:

threading one or more coaxial cables or microcoaxial cables through one or more optional alignment substrates, respectively wherein said optional alignment substrates support or align the one or more cables or an array of cables; and

improving signal integrity probing by separately placing a first grounding pin connected to a ground layer having its own elastomeric coating thereon, said grounding pin being affixed on top of one of one or more an electrically conductive disc formed as a metallic disc isolated from other pins having elastomeric coatings thereon and separately placing a central coaxial conductive pin having an elastomeric coating thereon, said central coaxial pin being affixed on top of one of one or more said electrically conductive discs formed as a metallic disc, said coaxial pin being isolated from other pins having elastomeric coatings thereon and separately placing another of said grounding pins connected to the ground layer having its own elastomeric coating thereon, said grounding pin being affixed on top of one or more electrically conductive discs each of which are formed as a metallic disc isolated from other pins having elastomeric coatings thereon so that each of said grounding and central coaxial elastomeric pins are placed in fixed contact with at least one of a center conductive region of said one or more cables cable or said microcoaxial cables so that by isolating said elastomeric regions from each other it prevents electrical shorting and improves signal integrity probing.