Wire splicing device, wire splicing method, and method for manufacturing splice structure

• US 9,685,769 B2
• Filed: 05/28/2014
• Issued: 06/20/2017
• Est. Priority Date: 05/28/2013
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Fujita, Shinji
• Primary Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US14/893,814
• Publication Number:
  US 20160105005A1
• Time in Patent Office: 1,119 Days
• Field of Search: 228904, 2281805, 228 45, 2282331, 2282341, 2282351, 228 41, 228 62
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 3/04 Heating appliances soldering lamps or blowpipes F23D; electric heating in general H05B
• CPC Class Codes: B23K 3/085 Cooling, heat sink or heat shielding means
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: B23K 37/0408 for planar work
• CPC Class Codes: H01B 12/00 Superconductive or hyperconductive conductors, cables, or transmission lines
• CPC Class Codes: H01B 12/04 Single wire
• CPC Class Codes: H01R 4/022 comprising preapplied solder
• CPC Class Codes: H01R 4/027 comprising means for positioning or holding the parts to be soldered or welded
• CPC Class Codes: H01R 4/68 Connections to or between superconductive connectors
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/0263 for positioning or holding parts during soldering or welding process
• CPC Class Codes: H02G 1/005 for cutting cables or wires, or splicing

Abstract

A wire connection device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate away from or toward one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween.

Claims

1. A wire splicing device comprising:

a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires;

a pressing plate which is positioned above the holding base;

a heating body which is positioned above the pressing plate and includes a heating member;

a first driver which drives the holding base and the pressing plate toward or away from one another; and

a second driver which drives the holding base and the heating body toward or away from one another, wherein

the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween, and

the heating body which is driven toward the holding base by the second driver presses together and heats, via the pressing plate, the plurality of wires accommodated in the wire accommodation groove with solder therebetween.

2. The wire splicing device according to claim 1, wherein

the holding base is made of an insulating material.

3. The wire splicing device according to claim 1, further comprising:

a cooling member which cools the pressing plate.

4. The wire splicing device according to claim 1, wherein

the first driver is a first air cylinder which raises and lowers the pressing plate, and the second driver is a second air cylinder which raises and lowers the heating body.

5. The wire splicing device according to claim 2, further comprising:

a cooling member which cools the pressing plate.

6. The wire splicing device according to claim 2, wherein

the first driver is a first air cylinder which raises and lowers the pressing plate, and the second driver is a second air cylinder which raises and lowers the heating body.

7. The wire splicing device according to claim 3, wherein

the first driver is a first air cylinder which raises and lowers the pressing plate, and the second driver is a second air cylinder which raises and lowers the heating body.

8. The wire splicing device according to claim 5, wherein

the first driver is a first air cylinder which raises and lowers the pressing plate, and the second driver is a second air cylinder which raises and lowers the heating body.