Liquid cooled metal core printed circuit board

• US 9,686,887 B2
• Filed: 09/15/2015
• Issued: 06/20/2017
• Est. Priority Date: 09/15/2014
• Status: Active Grant

• Current Assignee: D'Onofrio, Nicholas Michael
• Original Assignee: D'Onofrio, Nicholas Michael
• Inventors: D'Onofrio, Nicholas Michael
• Primary Examiner(s): Dravininkas, Adam B
• Application Number:
  US14/854,402
• Publication Number:
  US 20160081178A1
• Time in Patent Office: 644 Days
• Field of Search: 36167946, 36167953, 361698, 361699, 361702, 361707, 361705, 361715, 361719, 165 802, 165 804, 165 805, 16510433, 165166, 165185, 165908, 174 151, 174 163, 174520, 257714, 362294, 36224902
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954

Abstract

The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.

Claims

1. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core printed circuit board;

wherein an entirety of the exterior surface of the liquid cavity creating component interfaces directly with the ambient environment; and

wherein the exterior surface of the liquid cavity creating component includes an external thermal interface.

2. The direct liquid cooled metal core printed circuit board system of claim 1, wherein the liquid cavity creating component and the base plate of the metal core printed circuit board are the same material.

3. The direct liquid cooled metal core printed circuit board system of claim 1, wherein the liquid cavity creating component is aluminum.

4. The direct liquid cooled metal core printed circuit board system of claim 1, wherein a light emitting diode is operatively coupled to the metal core printed circuit board.

5. The direct liquid cooled metal core printed circuit board system of claim 4, wherein the exterior surface of the liquid cavity creating component includes at least one external thermal interface.

6. The direct liquid cooled metal core printed circuit board system of claim 1, further comprising:

a metal core printed circuit board cover; and

a second fastening mechanism coupling the metal core printed circuit board cover to the metal core printed circuit board.

7. The direct liquid cooled metal core printed circuit board system of claim 1, further comprising:

a first liquid port and a second liquid port located in the liquid cavity creating component, wherein the liquid coolant enters the liquid cavity through the first liquid port and exits the liquid cavity through the second liquid port.

8. The direct liquid cooled metal core printed circuit board system of claim 7, wherein the exterior surface of the liquid cavity creating component includes at least one external thermal interface.

9. The direct liquid cooled metal core printed circuit board system of claim 7, wherein the liquid cavity creating component is made of the same material as the base plate of the metal core printed circuit board.

10. The direct liquid cooled metal core printed circuit board system of claim 7, wherein the liquid cavity creating component is made of aluminum.

11. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;

wherein the liquid cavity creating component includes an external fastening mechanism.

12. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;

wherein an entirety of the exterior surface of the liquid cavity creating component interfaces directly with the ambient environment;

wherein a light emitting diode is operatively coupled to the metal core printed circuit board; and

wherein the liquid cavity creating component is made of the same material as the base plate of the metal core printed circuit board.

13. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;

wherein an entirety of the exterior surface of the liquid cavity creating component interfaces directly with the ambient environment;

wherein a light emitting diode is operatively coupled to the metal core printed circuit board; and

wherein the liquid cavity creating component is aluminum.

14. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;

a first liquid port and a second liquid port located in the liquid cavity creating component, wherein the liquid coolant enters the liquid cavity through the first liquid port and exits the liquid cavity through the second liquid port;

a metal core printed circuit board cover; and

a second fastening mechanism coupling the metal core printed circuit board cover to the metal core printed circuit board.

15. A direct liquid cooled metal core printed circuit board system comprising:

a liquid cavity creating component having an interior surface and an exterior surface, wherein the liquid cavity creating component is coupled to a base plate of a metal core printed circuit board by a first fastening mechanism to form a cavity between the interior surface of the liquid cavity creating component and the base plate of the metal core print circuit board;

a first liquid port and a second liquid port located in the liquid cavity creating component, wherein the liquid coolant enters the liquid cavity through the first liquid port and exits the liquid cavity through the second liquid port;

a metal core printed circuit board cover; and

a second fastening mechanism coupling the metal core printed circuit board cover to the metal core printed circuit board;

wherein the exterior surface of the liquid cavity creating component includes at least one external thermal interface.

16. A method for direct cooling of a metal core printed circuit board, the method comprising:

coupling a liquid cavity creating component having an exterior surface to a metal core printed circuit board; and

introducing a liquid coolant into a liquid cavity formed between the liquid cavity creating component and a base plate of the metal core printed circuit board, allowing the liquid coolant to directly contact the base plate of the metal core printed circuit board;

wherein an entirety of the exterior surface of the liquid cavity creating component interfaces directly with the ambient environment; and

wherein the exterior surface of the liquid cavity creating component includes an external thermal interface.