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Micro-electro-mechanical device having two buried cavities and manufacturing process thereof

  • US 9,688,531 B2
  • Filed: 06/23/2016
  • Issued: 06/27/2017
  • Est. Priority Date: 11/19/2015
  • Status: Active Grant
First Claim
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1. A micro-electro-mechanical device, comprising:

  • a monolithic body of semiconductor material having a first face and a second face;

    a first buried cavity in the monolithic body of semiconductor material;

    a sensitive region in the monolithic body facing the first buried cavity;

    a movable element over a second cavity that faces the first buried cavity; and

    a decoupling trench extending from the first face of the monolithic body as far as the first buried cavity, the decoupling trench separating the sensitive region from a peripheral portion of the monolithic body.

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