Information carrying card comprising a cross-linked polymer composition, and method of making the same

• US 9,688,850 B2
• Filed: 07/22/2015
• Issued: 06/27/2017
• Est. Priority Date: 04/03/2012
• Status: Active Grant

• Current Assignee: IDEMIA America Corp. (Advent International Corporation)
• Original Assignee: X-Card Holdings LLC
• Inventors: Cox, Mark A.
• Primary Examiner(s): Milakovich, Nathan
• Application Number:
  US14/806,272
• Publication Number:
  US 20150327365A1
• Time in Patent Office: 706 Days
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2264/02 Synthetic macromolecular particles
• CPC Class Codes: B32B 2307/748 Releasability
• CPC Class Codes: B32B 2307/75 Printability
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/20 using fillers, pigments, thixotroping agents
• CPC Class Codes: B32B 27/205 the fillers creating voids or cavities, e.g. by stretching
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 3/18 characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: B32B 3/26 characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids foam layer B32B5/18; layer of synthetic resin characterised by fillers that create voids or cavities B32B27/205; characterised by an apertured layer
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: B32B 37/08 characterised by the cooling method
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: C08L 27/06 Homopolymers or copolymers of vinyl chloride
• CPC Class Codes: C08L 33/14 : of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• CPC Class Codes: C08L 63/10 : Epoxy resins modified by unsaturated compounds
• CPC Class Codes: C08L 75/04 : Polyurethanes
• CPC Class Codes: C08L 75/06 : from polyesters
• CPC Class Codes: C08L 75/14 : Polyurethanes having carbon-to-carbon unsaturated bonds
• CPC Class Codes: C08L 75/16 : having terminal carbon-to-carbon unsaturated bonds
• CPC Class Codes: G06K 19/07722 : the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07745 : Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0313 : Organic insulating material
• CPC Class Codes: H05K 1/0353 : consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09036 : Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/10037 : Printed or non-printed battery
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31529 : Next to metal
• CPC Class Codes: Y10T 428/31598 : Next to silicon-containing [silicone, cement, etc.] layer
• CPC Class Codes: Y10T 428/31605 : Next to free metal
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31667 : Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31692 : Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31699 : Ester, halide or nitrile of addition polymer

Abstract

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Claims

1. A core layer for an information carrying card, comprising

at least one thermoplastic layer defining at least one cavity therein, each cavity having a continuous surface profile solely defined by and inside the at least one thermoplastic layer, the continuous surface profile having a bottom wall surface and a side wall surface;

an inlay layer comprising at least one electronic component, the at least one electronic component partially or fully disposed inside the at least one cavity;

a crosslinked polymer composition disposed in the at least one cavity and contacting the at least one electronic component, the crosslinked polymer composition comprising;

a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and

a particulate thermoplastic filler.

2. The core layer for an information carrying card of claim 1 wherein the at least one thermoplastic layer is selected from the group consisting of polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS).

3. The core layer for an information carrying card of claim 1 wherein the at least one electronic component in the inlay layer comprises at least one integrated circuit (IC), wherein the at least one integrated IC is partially or fully disposed inside the at least one cavity and over the at least one thermoplastic layer.

4. The core layer for an information carrying card of claim 1 wherein the base polymer resin in the crosslinked polymer composition comprises epoxy or urethane acrylate.

5. The core layer for an information carrying card of claim 1 wherein the particulate thermoplastic filler in the crosslinked polymer composition comprises a material selected from the group consisting of PVC, a copolymer of vinyl chloride and at least another monomer, and polyethylene terephthalate (PET).

6. The core layer for an information carrying card of claim 1 wherein the crosslinked polymer composition comprises in the range of about 0.5 wt. % to about 50 wt. % of the particulate thermoplastic filler.

7. The core layer for an information carrying card of claim 1 wherein the crosslinked polymer composition comprises in the range of about 5 wt. % to about 20 wt. % of the particulate thermoplastic filler.

8. The core layer for an information carrying card of claim 1 further comprising a piece of metal or ceramic.

9. The core layer for an information carrying card of claim 1 wherein the at least one electronic component in the inlay layer comprises a battery.

10. The core layer for an information carrying card of claim 1 wherein the size of the at least one cavity is larger than the size of the inlay layer, and the inlay layer is fully disposed inside the at least one cavity.

11. The core layer for an information carrying card of claim 1 wherein the size of the at least one cavity is the same as or slightly larger than the size of the inlay layer, and the shape of the at least one cavity matches with the shape of the inlay layer.

12. The core layer for an information carrying card of claim 1 wherein the size of the at least one cavity is less than the size of the inlay layer, and the inlay layer is partially disposed inside the at least one cavity.

13. The core layer for an information carrying card of claim 1, wherein the crosslinked polymer composition is more flexible than the thermoplastic layer defining at one cavity therein.

14. An information carrying card comprising

at least one thermoplastic layer defining at least one cavity therein, each cavity having a continuous surface profile solely defined by and inside the at least one thermoplastic layer, the continuous surface profile having a bottom wall surface and a side wall surface;

an inlay layer comprising at least one electronic component, the at least one electronic component partially or fully disposed inside the at least one cavity;

a crosslinked polymer composition disposed in the at least one cavity and contacting the at least one electronic component, the crosslinked polymer composition comprising;

a base polymer resin selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and

a particulate thermoplastic filler.

15. The information carrying card of claim 14 wherein the at least one thermoplastic layer is selected from the group consisting of polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS).

16. The information carrying card of claim 14 wherein the at least one electronic component in the inlay layer comprises at least one integrated circuit (IC), wherein the at least one integrated IC is partially or fully disposed inside the at least one cavity and over the at least one thermoplastic layer.

17. The information carrying card of claim 14 wherein the base polymer resin in the crosslinked polymer composition comprises epoxy or urethane acrylate.

18. The information carrying card of claim 14 wherein the particulate thermoplastic filler in the crosslinked polymer composition comprises a material selected from the group consisting of PVC, a copolymer of vinyl chloride and at least another monomer, and polyethylene terephthalate (PET).

19. The information carrying card of claim 14 wherein the crosslinked polymer composition comprises in the range of about 0.5 wt. % to about 50 wt. % of the particulate thermoplastic filler.

20. The information carrying card of claim 14 wherein the at least one electronic component in the inlay layer further comprises at least one battery interconnected with at least one integrated circuit (IC).

21. The information carrying card of claim 14 further comprising a piece of metal or ceramic.

22. The information carrying card of claim 14 further comprising at least one printable thermoplastic film laminated onto the surface of the at least one thermoplastic layer and the crosslinked polymer composition.

23. The information carrying card of claim 22 further comprising at least one transparent film laminated onto the surface of the printable thermoplastic film.

24. A core layer for a plurality of information carrying cards, comprising

at least one thermoplastic layer defining a plurality cavities therein, each cavity having a continuous surface profile solely defined by and inside the at least one thermoplastic layer, the continuous surface profile having a bottom wall surface and a side wall surface;

a plurality of inlay layers, each inlay layer comprising at least one electronic component, the at least one electronic component partially or fully disposed inside the at least one cavity;

a crosslinked polymer composition disposed in each of the plurality of cavities and contacting the at least one electronic component, the crosslinked polymer composition comprising;

a base polymer resin selected from the group consisting of urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, methacrylate, silicone, urethane and epoxy; and

a particulate thermoplastic filler.

25. The core layer of claim 24 wherein

the at least one thermoplastic layer is selected from the group consisting of polyvinyl chloride, copolymer of vinyl chloride, polyolefin, polycarbonate, polyester, polyamide, and acrylonitrile butadiene styrene copolymer (ABS);

and

the base polymer resin in the crosslinked polymer composition comprises epoxy or urethane acrylate.