Methods for enhancing propped fracture conductivity
First Claim
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1. A method of treating a subterranean formation, the method comprising:
- providing a pad fluid comprising a tackifier and a first proppant, wherein the first proppant comprises a particle size of 150 mesh or smaller, and wherein the tackifier is at least partially coated on the first proppant, the pad fluid having a viscosity of less than about 20 cP at standard temperature and pressure;
fracturing the subterranean formation with the pad fluid and at least partially coating one or more fracture face with the tackifier;
providing a second fluid comprising a second proppant, wherein the second proppant comprises a particle size larger than the first proppant; and
placing the second fluid in fractures and fracture branches created in the subterranean formation by the pad fluid at a pressure greater than the fracture gradient of the subterranean formation.
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Abstract
Various embodiments disclosed relate to methods of treating a subterranean formations that provide enhanced fracture conductivity over other methods. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include obtaining or providing a composition including a tackifier. The composition can have a viscosity less than about 20 cP. The method can include placing the composition in a subterranean formation downhole. The method can also include fracturing the subterranean formation with the composition.
47 Citations
20 Claims
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1. A method of treating a subterranean formation, the method comprising:
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providing a pad fluid comprising a tackifier and a first proppant, wherein the first proppant comprises a particle size of 150 mesh or smaller, and wherein the tackifier is at least partially coated on the first proppant, the pad fluid having a viscosity of less than about 20 cP at standard temperature and pressure; fracturing the subterranean formation with the pad fluid and at least partially coating one or more fracture face with the tackifier; providing a second fluid comprising a second proppant, wherein the second proppant comprises a particle size larger than the first proppant; and placing the second fluid in fractures and fracture branches created in the subterranean formation by the pad fluid at a pressure greater than the fracture gradient of the subterranean formation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of treating a subterranean formation, the method comprising:
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placing in the subterranean formation a pad fluid comprising a tackifier, a first proppant and an organic clay stabilizer, the tackifier comprising a polyamide condensation product of a fatty acid and a polyamine, wherein the organic clay stabilizer is a 1,3-substituted 2-hydroxypropane, wherein the 1- and 3-positions are independently substituted by a moiety selected from the group consisting of pyridinium, alkyl pyridinium, and R3N+-, wherein each R is independently selected from the group consisting of benzyl, (C1-C12) alkyl, and (C1-C12) alkyl substituted by one hydroxy group, the composition having a viscosity of less than about 20 cP at standard temperature and pressure, wherein the first proppant comprises a particle size of 150 mesh or smaller; fracturing the subterranean formation with the pad fluid, to form at least one fracture; and substantially coating at least part of a face of the fracture with the pad fluid; placing a second fluid in fractures and fracture branches created in the subterranean formation by the pad fluid at a pressure greater than the fracture gradient of the subterranean formation, wherein the second fluid comprises a second proppant having a larger particle size than the first proppant; and forming at least one adhered at least partial layer of the second proppant on the face, wherein the tackifier enhance adhesion of the second proppant to the face; wherein the fractured subterranean formation has a higher permeability than a corresponding subterranean formation subjected to a corresponding method that is free of the tackifier and the organic clay stabilizer.
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Specification