Sensor unit, electronic apparatus and moving object

• US 9,689,885 B2
• Filed: 09/30/2014
• Issued: 06/27/2017
• Est. Priority Date: 10/08/2013
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Sakuma, Masayasu, Chino, Taketo
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US14/501,583
• Publication Number:
  US 20150096372A1
• Time in Patent Office: 1,001 Days
• Field of Search: 73493
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 3/00 Measuring linear or angular speed; Measuring differences of linear or angular speeds G01P5/00 - G01P11/00 take precedence; direction and speed indication G01P13/045; counting mechanisms G06M

Abstract

A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.

Claims

1. A sensor unit comprising:

an acceleration sensor having a sensor terminal;

a mount board on which the acceleration sensor is mounted;

a mount terminal that is provided on a main surface of the mount board and that is connected to the sensor terminal;

a via that is provided in the mount board; and

a wiring that continuously extends from the mount terminal, that is continuously provided on the main surface of the mount board, and that is continuously provided in the via, wherein

the mount board includes a glass fiber therein,

the via is laterally shifted from the acceleration sensor in a plan view, and

the wiring is a single member that is configured from a first part connecting to the mount terminal to a second part located in the via through a third part located on the main surface of the mount board.

2. The sensor unit according to claim 1, wherein the mount board includes an insulation part in an area where the acceleration sensor is overlapped with the mount board in the plan view, and an insulation surface is the main surface of the mount board.

3. The sensor unit according to claim 1, wherein the mount board includes a recessed part in an area where the acceleration sensor is overlapped with the mount board in the plan view.

4. The sensor unit according to claim 1, wherein the mount board includes a plurality of layers.

5. The sensor unit according to claim 1, wherein the sensor includes a groove part on a surface mounted on the mount board.

6. An electronic apparatus comprising:

the sensor unit according to claim 1; and

an arithmetic processing circuit that is configured to receive a detection signal from the sensor unit and that is configured to process the detection signal so as to output a processing result.

7. A moving object comprising:

the sensor unit according to claim 1; and

a control circuit that is configured to receive a detection signal from the sensor unit and that is configured to process the detection signal so as to output a processing result,

wherein the control circuit is configured to control motion of the moving object based on the processing result.