Adaptive electrical testing of wafers
First Claim
1. A computer-implemented method for determining one or more parameters for electrical testing of a wafer, comprising:
- determining a plurality of electrical test paths through a device being formed on a wafer and physical layout components in different layers of the device corresponding to each of the plurality of electrical test paths;
determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the plurality of electrical test paths;
acquiring information for one or more characteristics of a physical version of the wafer, wherein the information is generated by a process control system performing an inline process on the physical version of the wafer;
altering at least one of the one or more parameters based on the acquired information, wherein determining the plurality of electrical test paths, determining the one or more parameters, acquiring the information, and altering the at least one parameter are performed by a computer system, and wherein the computer system is a device having one or more processors; and
performing the electrical testing on the wafer with electrical testing equipment and the altered at least one of the one or more parameters.
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Abstract
A method and a system for determining one or more parameters for electrical testing of a wafer are provided. One method includes determining electrical test paths through a device being formed on a wafer and physical layout components in different layers of the device corresponding to each of the electrical test paths. The method also includes determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the electrical test paths. In addition, the method includes acquiring information for one or more characteristics of a physical version of the wafer. The information is generated by performing an inline process on the physical version of the wafer. The method further includes altering at least one of the one or more parameters of the electrical testing for the wafer based on the acquired information.
23 Citations
36 Claims
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1. A computer-implemented method for determining one or more parameters for electrical testing of a wafer, comprising:
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determining a plurality of electrical test paths through a device being formed on a wafer and physical layout components in different layers of the device corresponding to each of the plurality of electrical test paths; determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the plurality of electrical test paths; acquiring information for one or more characteristics of a physical version of the wafer, wherein the information is generated by a process control system performing an inline process on the physical version of the wafer; altering at least one of the one or more parameters based on the acquired information, wherein determining the plurality of electrical test paths, determining the one or more parameters, acquiring the information, and altering the at least one parameter are performed by a computer system, and wherein the computer system is a device having one or more processors; and performing the electrical testing on the wafer with electrical testing equipment and the altered at least one of the one or more parameters. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A non-transitory computer-readable medium, storing program instructions executing on a computer system for performing a computer-implemented method for determining one or more parameters for electrical testing of a wafer, wherein the computer-implemented method comprises:
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determining a plurality of electrical test paths through a device being formed on a wafer and physical layout components in different layers of the device corresponding to each of the plurality of electrical test paths based on design data for the device; determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the plurality of electrical test paths; acquiring information for one or more characteristics of a physical version of the wafer, wherein the information is generated by a process control system performing an inline process on the physical version of the wafer and wherein the information is acquired by the computer system from a storage medium in which the information has been stored by the process control system; and altering at least one of the one or more parameters based on the acquired information, wherein the computer system is a device having one or more processors.
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20. A system configured to determine one or more parameters for electrical testing of a wafer, comprising:
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a process control subsystem configured to acquire information for one or more characteristics of a physical version of a wafer, wherein the information is generated by performing an inline process on the physical version of the wafer; and a computer system configured for; determining a plurality of electrical test paths through a device being formed on the wafer and physical layout components in different layers of the device corresponding to each of the plurality of electrical test paths based on design data for the device; determining one or more parameters of electrical testing for the wafer based on one or more characteristics of the plurality of electrical test paths; and altering at least one of the one or more parameters based on the acquired information, wherein the computer system is a device having one or more processors, and wherein electrical testing equipment is configured to perform the electrical testing on the wafer with the altered at least one of the one or more parameters. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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Specification