Lithographic apparatus and device manufacturing method
First Claim
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1. A lithographic apparatus, configured to project an exposure beam of radiation onto a substrate, the apparatus comprising:
- a measurement system, configured to provide measurement data related to a thickness of a resist layer on a first region of the substrate, and configured to measure intensity of radiation derived from the exposure beam of radiation to expose the resist layer of the first region of the substrate, that is redirected back from the layer of resist to generate the measurement data; and
a controller, configured to control the operation of the lithographic apparatus such that a radiation intensity level in an exposure beam to be subsequently projected onto a different second region of the same substrate is controlled based on the measurement data.
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Abstract
A lithographic apparatus is provided and configured to project a patterned beam of radiation onto a substrate. The apparatus has a measurement system to provide measurement data related to a thickness of a resist layer on the substrate, and a controller to control the operation of the lithographic apparatus such that a radiation intensity level in the patterned beam to be projected onto the substrate is controlled based on the measurement data.
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Citations
19 Claims
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1. A lithographic apparatus, configured to project an exposure beam of radiation onto a substrate, the apparatus comprising:
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a measurement system, configured to provide measurement data related to a thickness of a resist layer on a first region of the substrate, and configured to measure intensity of radiation derived from the exposure beam of radiation to expose the resist layer of the first region of the substrate, that is redirected back from the layer of resist to generate the measurement data; and a controller, configured to control the operation of the lithographic apparatus such that a radiation intensity level in an exposure beam to be subsequently projected onto a different second region of the same substrate is controlled based on the measurement data. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A device manufacturing method, comprising:
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using a lithographic apparatus to project an exposure beam of radiation onto a substrate; obtaining measurement data related to a thickness of a resist layer on a first region of the substrate based on measuring intensity of radiation derived from the exposure beam of radiation to expose the resist layer, that is redirected back from the layer of resist; and controlling the operation of the lithographic apparatus to control the radiation intensity level in an exposure beam to be subsequently projected onto a different second region of the same substrate based on the measurement data.
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18. A lithographic apparatus, configured to project an exposure beam of radiation onto a substrate, the apparatus comprising:
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a measurement system configured to measure intensity of radiation derived from an exposure beam of radiation that is redirected back from a resist layer on a first region of the substrate; and a controller configured to; compare an intensity level of the exposure beam of radiation prior to incidence onto the resist layer with a measured intensity level of the radiation redirected back from the layer of resist to determine a measure of the reflectivity of the resist layer, and control the operation of the lithographic apparatus such that a radiation intensity level in an exposure beam to be subsequently projected onto a different second region of the substrate is controlled based on the measure. - View Dependent Claims (19)
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Specification