Contact pad for semiconductor device
First Claim
1. A method comprising:
- forming contact pads on substrate, the contact pads including a first contact pad, the contact pads providing electrical connections to circuitry on the substrate;
forming a dummy pad feature adjacent the first contact pad, the dummy pad feature not being electrically connected to electrical circuitry, the dummy pad feature being a single continuous conductive element having a concave opening, the first contact pad being within the concave opening; and
forming an external electrical connector on the first contact pad.
1 Assignment
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Accused Products
Abstract
A device and method of manufacture is provided that utilize a dummy pad feature adjacent contact pads. The contact pads may be contact pads in an integrated fan-out package in which a molding compound is placed along sidewalls of a die and the contact pads extend over the die and the molding compound. The contact pads are electrically coupled to the die using one or more redistribution layers. The dummy pad features are electrically isolated from the contact pads. In some embodiments, the dummy pad features partially encircle the contact pads and are located in a corner region of the molding compound, a corner region of the die, and/or an interface region between an edge of the die and the molding compound.
35 Citations
20 Claims
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1. A method comprising:
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forming contact pads on substrate, the contact pads including a first contact pad, the contact pads providing electrical connections to circuitry on the substrate; forming a dummy pad feature adjacent the first contact pad, the dummy pad feature not being electrically connected to electrical circuitry, the dummy pad feature being a single continuous conductive element having a concave opening, the first contact pad being within the concave opening; and forming an external electrical connector on the first contact pad. - View Dependent Claims (2, 3, 4, 5, 6, 20)
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7. A method comprising:
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forming a molding compound along sidewalls of a die; forming contact pads over the die and the molding compound; forming dummy pad features adjacent a subset of the contact pads, the dummy pad features being electrically isolated from the contact pads, at least one of the dummy pad features being a single continuous conductive element extending on opposing sides of a conductive line coupled to the at least of the dummy pad features; forming electrical connectors on the contact pads; and attaching a substrate to the electrical connectors. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method comprising:
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forming a molding compound along sidewalls of a die; forming one or more redistribution layers over the die and the molding compound; forming a plurality of contact pads over the one or more redistribution layers, a first subset of the plurality of contact pads being in a first region and a second subset of the plurality of contact pads being in a second region; and forming dummy pad features adjacent the first subset of the plurality of contact pads, the second subset of the plurality of contact pads being free of the dummy pad features, the dummy pad features being electrically isolated from the first subset of the plurality of contact pads, each of the dummy pad features being a single continuous conductive element extending along opposing sides of respective ones of the plurality of contact pads. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification