Package-on-package assembly with wire bonds to encapsulation surface
First Claim
1. A microelectronic package comprising:
- a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
at least one microelectronic element overlying the first surface within the first region and having contacts at a surface thereof;
first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element;
first wire bonds having bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each first wire bond defining an edge surface extending between the base and the end surface thereof;
second wire bonds having bases joined to respective ones of the contacts of the microelectronic element, and end surfaces remote from the surface of the microelectronic element and remote from the bases, each second wire bond defining an edge surface extending between the base and the end surface thereof; and
a dielectric encapsulation layer extending from at least one of the first or second surfaces and filling spaces between the first wire bonds and between the second wire bonds such that the first wire bonds and the second wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the first wire bonds and the second wire bonds are defined by at least portions of the end surfaces of the first wire bonds and the second wire bonds that are uncovered by the encapsulation layer.
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Accused Products
Abstract
A method of making a microelectronic package includes forming a dielectric encapsulation layer on an in-process unit having a substrate having a first surface and a second surface remote therefrom. A microelectronic element is mounted to the first surface of the substrate, and a plurality of conductive elements exposed at the first surface, at least some of which are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the bases and define an edge surface extending away between the base and the end surface. The encapsulation layer is formed to at least partially cover the first surface and portions of the wire bonds with unencapsulated portions of the wire bonds being defined by at least one of the end surface or a portion of the edge surface that is uncovered thereby.
581 Citations
20 Claims
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1. A microelectronic package comprising:
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a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region and having contacts at a surface thereof; first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element; first wire bonds having bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each first wire bond defining an edge surface extending between the base and the end surface thereof; second wire bonds having bases joined to respective ones of the contacts of the microelectronic element, and end surfaces remote from the surface of the microelectronic element and remote from the bases, each second wire bond defining an edge surface extending between the base and the end surface thereof; and a dielectric encapsulation layer extending from at least one of the first or second surfaces and filling spaces between the first wire bonds and between the second wire bonds such that the first wire bonds and the second wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the first wire bonds and the second wire bonds are defined by at least portions of the end surfaces of the first wire bonds and the second wire bonds that are uncovered by the encapsulation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A microelectronic package comprising:
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a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region and having contacts at a surface thereof; first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element; first wire bonds having bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each first wire bond defining an edge surface extending between the base and the end surface thereof; and second wire bonds having bases joined to respective ones of the contacts of the microelectronic element, and end surfaces remote from the surface of the microelectronic element and remote from the bases, each second wire bond defining an edge surface extending between the base and the end surface thereof. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification