Semiconductor package with elastic coupler and related methods

• US 9,691,732 B2
• Filed: 08/05/2016
• Issued: 06/27/2017
• Est. Priority Date: 02/19/2015
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Lin, Yusheng, Chew, Chee Hiong, Carney, Francis J.
• Primary Examiner(s): Ullah, Elias M
• Application Number:
  US15/230,076
• Publication Number:
  US 20160343683A1
• Time in Patent Office: 326 Days
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04034 Bonding areas specifically adapted for strap connectors
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 2224/40139 with an intermediate bond, e.g. continuous strap daisy chain
• CPC Class Codes: H01L 2224/40225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 23/041 : the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/053 : the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/057 : the leads being parallel to the base
• CPC Class Codes: H01L 23/10 : characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/4006 : with bolts or screws
• CPC Class Codes: H01L 23/492 : Bases or plates or solder therefor
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49844 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/50 : for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01R 4/4863 : Coil spring
• CPC Class Codes: H01R 4/489 : spring force increased by screw, cam, wedge, or other fastening means

Abstract

A semiconductor package includes: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die. The pin includes a reversibly elastically deformable lower portion, which in implementations includes a spring, configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate. The pin is fixedly coupled in a top of the housing and is configured to be coupled with the substrate by lowering the housing towards the substrate. In implementations the pin includes two rigid portions coupled together only with a coil spring, the spring biasing the rigid portions away from one another when the housing is lowered towards the substrate.

Claims

1. A semiconductor package, comprising:

a die coupled to a substrate;

a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and;

a pin fixedly coupled to the housing and electrically coupled with the die, the pin comprising a reversibly elastically deformable lower portion coupled with a lower end of the pin comprising a flat plate;

wherein the reversibly elastically deformable lower portion is located in the pin between the housing and the substrate; and

wherein the reversibly elastically deformable lower portion is configured to compress to prevent the lower end of the pin from lowering beyond a predetermined point relative to the flat plate and the lower end of the pin when the housing is lowered to be coupled to the substrate.

2. The semiconductor package of claim 1, wherein a base of the pin is coupled to the substrate with a spring.

3. The semiconductor package of claim 1, wherein the pin is fixedly coupled in a top of the housing and is configured to be coupled with the substrate by lowering the housing towards the substrate.

4. The semiconductor package of claim 1, wherein the pin includes two rigid portions coupled together only with a spring.

5. The semiconductor package of claim 4, wherein one of the rigid portions comprises a flat plate.

6. The semiconductor package of claim 1, wherein the reversibly elastically deformable lower portion comprises a spring.

7. The semiconductor package of claim 6, wherein the spring comprises a coil spring.

8. A semiconductor package, comprising:

at least one die coupled to a substrate;

a housing coupled to the substrate and at least partially enclosing the at least one die within a cavity of the housing, and;

a plurality of pins fixedly coupled in a top of the housing, each of the plurality of pins electrically coupled with one of the at least one die through a connection trace of the substrate, each of the plurality of pins comprising a spring between an upper portion of the pin and a lower portion of the pin, the lower portion of the pin comprising a flat plate,

wherein the spring of each pin biases an upper portion of the pin towards the housing; and

wherein the spring is located in the pin between the housing and the substrate.

9. The semiconductor package of claim 8, wherein the spring of each pin is positioned between two rigid portions of the pin.

10. The semiconductor package of claim 9, wherein the spring of each pin biases the two rigid portions of the pin away from one another.

11. The semiconductor package of claim 8, wherein the spring of each pin is compressed along a direction substantially parallel with a longest length of the pin.

12. The semiconductor package of claim 8, wherein the spring of each pin is configured to prevent a contact surface of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered towards the substrate.

13. The semiconductor package of claim 8, wherein the spring is a helical spring.