System and method for flux coat, reflow and clean

• US 9,694,436 B2
• Filed: 11/03/2014
• Issued: 07/04/2017
• Est. Priority Date: 11/04/2013
• Status: Expired due to Fees

• Current Assignee: Veeco Instruments Incorporated
• Original Assignee: Veeco Precision Surface Processing LLC (Veeco Instruments Incorporated)
• Inventors: Breingan, William Gilbert, Clark, John, Taddei, John, Mauer, Laura, Rapoport, Lev
• Primary Examiner(s): Saad, Erin
• Assistant Examiner(s): GAMINO, CARLOS J
• Application Number:
  US14/531,699
• Publication Number:
  US 20150122876A1
• Time in Patent Office: 974 Days
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/008 Soldering within a furnace B23K1/012 takes precedence
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 1/206 Cleaning
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/082 Flux dispensers; Apparatus for applying flux
• CPC Class Codes: B23K 3/085 Cooling, heat sink or heat shielding means

Abstract

The use of lead-free solder (flux) in Wafer Level Packaging applications requires more control of the temperature and environment during the reflow process. The flux needs to be applied by spin coating, reflowed in a controlled environment and then removed with a cleaning process. Incorporating these three processes in one compact system provides an efficient and economical solution. The unique design of the reflow oven consists of multiple hotplates and one cold plate, arranged in a circle to allow wafers to proceed through the oven in a rotary fashion.

Claims

1. A system for performing a solder reflow process comprising a plurality of stations within one system frame comprising:

a first station for coating flux on a substrate;

a second station for reflowing the flux on the substrate;

a third station for removing the flux and cleaning the substrate; and

an automated transfer device for transferring the substrate from one station to another station;

wherein the second station includes a circular shaped reflow device that has multiple spaces to provide a temperature profile for reflowing the flux in a controlled low oxygen environment;

wherein the reflow device includes a housing that defines a hollow interior, the housing including a door for both loading and unloading the substrate from the reflow device, the housing being divided into a first substrate space in which the substrate is in a first position;

a second substrate space in which the substrate is in a second position;

third substrate space in which the substrate is in a third position; and

a fourth substrate space in which the substrate is in a fourth position, wherein the first substrate space is located behind the door such that the first position defines an initial loading and unloading position;

wherein the first substrate space is selectively sealed off from the second, third and fourth substrates spaces with a controllable mechanism to prevent air from flowing between the first substrate space and the other substrate spaces; and

wherein the controllable mechanism comprises a pair of shutters that move between open and closed positions, wherein in the closed position, the shutters seal the first substrate space from the rest of the interior of the housing, thereby allowing the door to be opened or closed without introducing air into the rest of the interior including the other substrate spaces.

2. The system of claim 1, wherein the first station includes one or more first devices for coating the flux;

the second station includes one or more second devices for reflowing the flux and the third stations includes one or more third devices for removing the flux and cleaning the substrate; and

the automated transfer device comprises a single robot.

3. The system of claim 2, wherein the first devices are arranged in a stacked manner at the first station, the second devices are arranged in a stacked manner at the second station, and the third devices are arranged in a stacked manner at the third station.

4. The system of claim 1, wherein the reflow device is automated such that the substrate is advanced into each of the spaces and is held thereat for a predetermined period of time to effectuate reflow of the flux.

5. The system of claim 4, wherein the multiple spaces includes at least one space for heating the substrate and at least one space for cooling the substrate.

6. The system of claim 5, wherein there are two or more spaces for heating the substrate and a single space for cooling the substrate.

7. The system of claim 4, wherein the reflow device is an automated indexed device.

8. The system of claim 1, wherein the system is configured such that after loading a substrate through the open door into the first substrate space, a purging step is performed to create a low oxygen environment in the first substrate space which is sealed off due to the shutters being in the closed positions.

9. The system of claim 1, further including one substrate support that for each of the first, second, third and fourth substrate spaces, the substrate support being connected to one another such that all of the substrate supports are part of an automated device and all move in unison, each substrate support being configured to hold one substrate.

10. The system of claim 9, wherein the substrate supports are connected a common central hub that is rotatably driven so as to index the substrate supports from one position to a next position.

11. The system of claim 10, wherein the substrate supports are operatively connected to an actuator that allows each substrate support to move between a raised position and a lowered position.

12. The system of claim 11, wherein the actuator comprises a pneumatic cylinder.

13. The system of claim 9, wherein the first space being a cooling zone, while, the second, third and fourth spaces comprise heating zones.

14. The system of claim 13, further including a cold plate disposed in the first substrate space,

a first hot plate disposed in the second substrate space,

a second hot plate disposed in the third substrate space, and

a third hot plate disposed in the fourth substrate space,

the substrate supports being disposed above the cold and hot plates and operatively connected to an actuator that allows each substrate support to move between a raised position and a lowered position relative to the underlying cold and hot plates and be advanced from one position to the next position.

15. The system of claim 14, further including pedestals that extend upwardly above a top surface of each hot plate for supporting and suspending the substrate a prescribed distance above the hot plate.

16. The system of claim 14, wherein the cold plate is operatively connected to a mechanism that permits the cold plate to be moved between a raised position and a lowered position, wherein in the raised position, the cold plate is in contact with the substrate being held by the substrate support in the first position for rapid cooling thereof and in the lowered position, the substrate supports can freely move in an indexed manner above each of the cold and hot plates.

17. The system of claim 14, wherein the first hot plate is heated to a first temperature, the second hot plate is heated to a second temperature and the third hot plate is heated to a third temperature, wherein the first temperature<

the second temperature<

the third temperature.