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Three-dimensional (3D) photonic chip-to-fiber interposer

  • US 9,696,498 B2
  • Filed: 05/04/2015
  • Issued: 07/04/2017
  • Est. Priority Date: 05/04/2015
  • Status: Active Grant
First Claim
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1. An optical coupling device comprising:

  • a substrate platform comprising a first surface, a second surface adjacent to the first surface, and a third surface adjacent to the first surface and opposite the second surface; and

    an array of waveguides comprising a first waveguide, disposed in the substrate platform, and extending from the second surface to the third surface,wherein the array of waveguides corresponds to an array of ion-exchanged channels in the substrate platform provided by a process,wherein the array of waveguides comprises an array pitch with a large pitch end at the second surface and a small pitch end at the third surface, andwherein the first waveguide comprises a cylindrically-shaped tapered structure that tapers down vertically and laterally with respect to the first surface from the large pitch end to the small pitch end.

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