Passive smart cards, metal cards, payment objects and smart jewelry

• US 9,697,459 B2
• Filed: 09/22/2015
• Issued: 07/04/2017
• Est. Priority Date: 08/10/2014
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Primary Examiner(s): FRANKLIN, JAMARA ALZAIDA
• Application Number:
  US14/862,119
• Publication Number:
  US 20160110639A1
• Time in Patent Office: 651 Days
• Field of Search: 235492
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/21 by welding
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: G06K 7/10336 the antenna being of the near field type, inductive coil
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

Claims

1. An RFID device comprising:

a transponder chip module (TCM) comprising an RFID chip (IC) and a module antenna (MA);

characterized by;

a coupling frame (CF) comprising a conductive surface and having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS) extending through the surface from an outer edge thereof to an inner position thereof, wherein the coupling frame is disposed so that the slit overlaps a portion of the module antenna;

wherein;

at least one of the coupling frame and the module antenna is moveable with respect to the other so that communication with the transponder chip module may selectively be enhanced or suppressed.

2. The RFID device of claim 1, wherein:

in a first position, the slit of the coupling frame overlaps the module antenna; and

in a second position, the slit of the coupling frame does not overlap the module antenna.

3. The RFID device of claim 2, wherein:

the coupling frame can be rotated, toggled, slid, or flipped with respect to the transponder chip module.

4. The RFID device of claim 1, wherein:

the RFID device comprises two transponder chip modules (TCM-1, TCM-2);

the coupling frame is moveable with respect to the two transponder chip modules so that communication with a selected one of the transponder chip modules may selectively be enhanced or suppressed.

5. The RFID device of claim 1, wherein:

the coupling frame comprises a component of a payment object.

6. The RFID device of claim 1, further comprising:

means for shorting the slit to suppress communication with the transponder chip module.

7. The RFID device of claim 6, wherein:

the means for shorting comprises a switch (SW).

8. The RFID device of claim 6, wherein:

the means for shorting comprises a second coupling frame (CF-2).

9. The RFID device of claim 1, wherein:

the slit covers at least a substantial portion of an entire central area of the module antenna, including at least 50%, at least 60%, at least 90%, and at least 100% thereof.

10. The RFID device of claim 1, wherein:

the RFID device comprises two coupling frames, each having a slit;

wherein;

a first of the two coupling frames is positioned so that its slit overlaps the module antenna of the transponder chip module; and

a second of the two coupling frames is movable so that (i) in a first position, the slits of the two coupling frames are aligned with one another and (ii) in a second position, the slits of the two coupling frames are aligned away from one another.

11. The RFID device of claim 1, wherein:

the transponder chip module has a form factor of a SIM card; and

the RFID device is adapted to receive at least one such SIM card.

12. The RFID device of claim 1, wherein:

the coupling frame is tubular.

13. The RFID device of claim 1, wherein:

the RFID device is selected from the group consisting of plastic smartcard, metal smartcard, hybrid smartcard, payment object, wearable device, and smart jewelry.

14. The RFID device of claim 1, wherein:

the RFID device comprises a payment object selected from the group consisting of plastic smartcard, metal smartcard, hybrid smartcard, payment object, wearable device, and smart jewelry.

15. A method of selectively enhancing or suppressing communication with a transponder chip module (TCM) comprising an RFID chip (IC) and a module antenna (MA), the method comprising:

providing a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive strips (NCS); and

moving at least one of the transponder chip module (TCM) and the coupling frame (CF) so that (i) the slit overlaps the module antenna (MA) to enhance communication; and

(ii) the slit does not overlap the module antenna to suppress communication.

16. The method of claim 15, wherein:

the RFID device comprises a second transponder chip module (TCM-2); and

moving the coupling frame enables one or the other of the two transponder chip modules.

17. The method of claim 15, wherein:

the RFID device comprises a payment object selected from the group consisting of plastic smartcard, metal smartcard, hybrid smartcard, payment object, wearable device, and smart jewelry.

18. A card body construction for a smart card (SC) comprising:

a first metal layer having an opening for receiving the a first portion of a transponder chip module and a slit extending from the opening to an outer edge of the layer, so that the layer may function as a coupling frame;

a second metal layer has having an opening for receiving a second portion of the transponder chip module and a slit extending from the opening to an outer edge of the layer, so that the slit overlaps a module antenna of the transponder chip module; and

a third metal layer having a slit overlapping the module antenna of the transponder chip module.

19. The card body construction of claim 18, wherein:

the third metal layer does not have an opening for receiving the transponder chip module.