Connection system for electronic components

• US 9,698,130 B2
• Filed: 09/22/2016
• Issued: 07/04/2017
• Est. Priority Date: 09/24/2015
• Status: Active Grant

• Current Assignee: AT&S Austria Technologie & Systemtechnik AG
• Original Assignee: AT&S Austria Technologie & Systemtechnik AG
• Inventors: Weis, Gerald, Sekavcnik, Roland, Vockenberger, Christian
• Primary Examiner(s): Blum, David S
• Application Number:
  US15/272,568
• Publication Number:
  US 20170092630A1
• Time in Patent Office: 285 Days
• Field of Search: 257713
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/2518 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2225/1035 the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
• CPC Class Codes: H01L 2225/1047 Details of electrical connections between containers
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 25/074 Stacked arrangements of non-apertured devices
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/1033 Gallium nitride [GaN]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/1426 : Driver
• CPC Class Codes: H01L 2924/1436 : Dynamic random-access memory [DRAM]
• CPC Class Codes: H01L 2924/153 : Connection portion
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19102 : in a stacked assembly with the semiconductor or solid state device
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/0206 : by printed thermal vias
• CPC Class Codes: H05K 1/0209 : External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 1/0212 : Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 1/0298 : Multilayer circuits
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 7/20154 : Heat dissipaters coupled to components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).

Claims

1. A connection system for electronic components (1) comprising:

a plurality of insulating layers (2) and conductive layers (3); and

at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3),

wherein the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).

2. The connection system for electronic components (1) of claim 1, wherein the thermal contact between the bulk terminal and the plurality of vias (7) forming the thermal duct mediated by a plurality of vias (5) electrically connecting the bulk terminal to a conductive layer (3) of the connection system for electronic components (1).

3. The connection system for electronic components (1) of claim 1, further comprising at least one second transistor (4) arranged opposite the first transistor relative to a central insulating layer of the connection system for electronic components (1) and having a bulk terminal thereof connected by a plurality of vias (5) to at least one second surface-mounted electronic component (10′

) arranged on a second outer surface (8′

) of the connection system for electronic components (1) opposite the first outer surface (8).

4. The connection system for electronic components (1) of claim 1, wherein the second surface-mounted device is an integrated circuit adapted to drive the at least one first and second transistors.

5. The connection system for electronic components (1) of claim 3, wherein the connection system for electronic components (1) comprises a first group of two first transistors (4) connected in parallel and a second group of two second transistors (4) connected in parallel, the first and the second group being connected in series.

6. The connection system for electronic components (1) of claim 1, wherein the vias (7) are in thermal contact with a heat spreading plate arranged on or within the connection system for electronic components (1).

7. The connection system for electronic components (1) of claim 1, wherein the vias (7) are in thermal contact with a conductive adhesive (11) arranged between the outer surface (8) of the connection system for electronic components (1) and the at least one surface-mounted electronic component (10).

8. The connection system for electronic components (1) of claim 1, wherein the at least one first surface-mounted component (10) is an anti-ferroelectric capacitor.

9. The connection system for electronic components (1) of claim 1, wherein the at least one first and second transistor (4) is a transistor chosen from the group comprised of a field effect transistor, in particular a gallium-nitride power transistor, and an insulated gate bipolar transistor.

10. The connection system for electronic components (1) of claim 1, wherein the at least one first surface-mounted component (10) and/or the at least one second surface-mounted component (10′

) cooperates with a cooling-fan.

11. The connection system for electronic components (1) of claim 3, wherein the at least one first and second transistors (4) are part of a partially embedded half-bridge circuit.

12. The connection system for electronic components (1) of claim 1, which further comprises at least one further embedded electronic component chosen from the group comprised of an electronic chip, in particular semiconductor chip, a capacitor, a resistor, an inductance, a data storage such as a DRAM, a filter, a microprocessor, a performance management component, an optoelectronic component, a voltage converter, an electromechanical transducer and/or -sensor and/or -actor, a transmitter and/or receiver of electromagnetic waves, a cryptographic component, a switch, a microelectromechanical system, a battery a camera and an antenna.