Micro assembled LED displays and lighting elements

• US 9,698,308 B2
• Filed: 06/18/2015
• Issued: 07/04/2017
• Est. Priority Date: 06/18/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Gomez, David, Bonafede, Salvatore, Fecioru, Alin, Bower, Christopher, Meitl, Matthew, Prevatte, Carl, Kneeburg, David
• Primary Examiner(s): Toledo, Fernando L
• Assistant Examiner(s): PRASAD, NEIL R
• Application Number:
  US14/743,919
• Publication Number:
  US 20160005721A1
• Time in Patent Office: 747 Days
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 26/04 by periodically varying the intensity of light, e.g. using choppers shutters, diaphragms for cameras G03B9/00; devices for eliminating or reducing the effect of flicker in projection systems G03B21/40
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2310/0264 Details of driving circuits
• CPC Class Codes: G09G 3/22 using controlled light sources
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/385 : the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0329 : Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 : Display
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 5/0017 : with operator interface units

Abstract

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Claims

1. A multi-mode display, comprising:

a display substrate in a direct-view flat-panel display;

a first emissive inorganic micro-LED display formed over a surface of the display substrate; and

a second display formed over the surface of the display substrate, the second display of a different type than the first emissive micro-LED display, wherein;

one or more pixels of the first display are spatially located between two or more pixels of the second display in a direction parallel to the surface of the display substrate,

the first display and the second display are independent displays such that the first display and the second display are independently operable to display different display images,

each inorganic light-emitting diode of the first display having an LED substrate distinct and separate from the display substrate and separate from the LED substrate of any other inorganic light-emitting diode, and

the light-emitting area of each inorganic light-emitting diode of the first emissive inorganic micro-LED display is smaller than the area of each of the pixels of the second display by at least a factor of 10.

2. The multi-mode display of claim 1, wherein the second display is a non-emissive reflective display.

3. The multi-mode display of claim 2, wherein the second display is an electrophoretic or MEMs-based display.

4. The multi-mode display of claim 1, wherein the first display comprises a plurality of first pixels and the second display comprises a plurality of second pixels, wherein each of the plurality of first pixels is smaller than each of the plurality of second pixels.

5. The multi-mode display of claim 1, comprising a controller for switching between the first display and the second display.

6. The multi-mode display of claim 1, comprising a cell phone, a smart phone, or a tablet computing device.

7. The multi-mode display of claim 1, wherein the first display is located over a different portion of the display substrate than the second display.

8. The multi-mode display of claim 1, wherein the first display and the second display are located over a common portion of the display substrate.

9. The multi-mode display of claim 8, wherein the first display is located on top of at least a portion of the second display on a side of the second display opposite the display substrate.

10. The multi-mode display of claim 8, wherein light-controlling elements of the first display are interspersed on the display substrate with light-controlling elements of the second display.

11. The multi-mode display of claim 1, wherein the micro-LEDs are formed in an native substrate distinct and separate from the display substrate.

12. The multi-mode display of claim 1, wherein the first display and the second display are formed on the display substrate.

13. The multi-mode display of claim 10, wherein the first display is on a first side of the display substrate and the second display is on a second side of the display substrate, opposite the first side.

14. The multi-mode display of claim 1, wherein the second display is on the display substrate and the first display is on a micro-LED display substrate, separate from the display substrate and located over the display substrate.

15. The display of claim 1, wherein the display substrate has a thickness from 5 to 10 microns, 10 to 50 microns, 50 to 100 microns, 100 to 200 microns, 200 to 500 microns, 500 microns to 0.5 mm, 0.5 to 1 mm, 1 mm to 5 mm, 5 mm to 10 mm, or 10 mm to 20 mm.

16. The display of claim 1, wherein each micro-LED has a width from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

17. The display of claim 1, wherein each micro-LED has a length from 2 to 5 μ

m, 5 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

18. The display of claim 1, wherein each micro-LED has with a height from 2 to 5 μ

m, 4 to 10 μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

19. The display of claim 1, wherein a resolution of the display is 120×

90, 1440×

1080, 1920×

1080, 1280×

720, 3840×

2160, 7680×

4320, or 15360×

8640.

20. The display of claim 1, wherein each micro-LED has an anode and a cathode on a same side of the respective micro-LED, and the anode and cathode of a respective light emitter are horizontally separated by a horizontal distance, wherein the horizontal distance is from 100 nm to 500 nm, 500 nm to 1 micron, 1 micron to 20 microns, 20 microns to 50 microns, or 50 microns to 100 microns.