Case, method of manufacturing case, and electronic device

• US 9,699,926 B2
• Filed: 03/13/2014
• Issued: 07/04/2017
• Est. Priority Date: 03/13/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Won-Tae, Hwang, Chang-Youn, Choi, Jong-Chul, Kim, Hak-Ju
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): Chowdhury, Rockshana
• Application Number:
  US14/210,191
• Publication Number:
  US 20140268525A1
• Time in Patent Office: 1,209 Days
• Field of Search: 36167901
• CPC Class Codes: B05D 3/144 of polymeric substrates
• CPC Class Codes: B05D 5/067 Metallic effect
• CPC Class Codes: B29C 2045/0079 applying a coating or covering
• CPC Class Codes: B29C 45/0053 combined with a final operation, e.g. shaping injection-compression moulding B29C45/561
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/0243 for decorative purposes

Abstract

A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer.

Claims

1. An electronic device comprising:

an outer housing forming an external appearance of the electronic device,

wherein a portion of the outer housing comprises;

an injection preform having a surface with a pattern, the pattern formed by a plurality of recesses formed on the surface, wherein the surface of the injection preform is processed to be roughened through a plasma process;

a deposition layer deposited on the plasma-processed surface of the injection preform, and having a first surface directly contacting on the surface of the injection preform, and a second surface facing an opposite direction of the first surface, wherein the second surface of the deposition layer comprises a plurality of recesses; and

a paint layer formed on the second surface of the deposition layer and having a flat surface, and

wherein the plurality of recesses of the second surface of the deposition layer have substantially identical shapes to the plurality of recesses of the injection preform,

wherein the injection preform includes a first injection-molded portion and a second injection-molded portion, the first injection-molded portion corresponds to a side of the electronic device, and the second injection-molded portion extends from the first injection-molded portion to an inside of the electronic device and includes a coupling member to couple to the electronic device.

2. The electronic device of claim 1, wherein the deposition layer is formed of a metallic material.

3. The electronic device of claim 1, wherein the paint layer is formed of a transparent or translucent material.

4. The electronic device of claim 1, wherein the surface of the injection preform for injection and the surfaces of the plurality of recesses have recesses having a diameter or size of one micrometer or less and formed at random.

5. The electronic device of claim 4, wherein the first surface of the deposition layer has a part to which at least one portion of the surfaces of the recesses is attached.

6. The electronic device of claim 1, wherein the electronic device comprises a portable terminal.

7. The electronic device of claim 6, wherein the electronic device is a display,

wherein the outer housing comprises:

a front surface facing in a same direction as the display does;

a back surface facing in an opposite direction of the front surface;

a side surface connecting the first surface and the second surface, and

wherein the portion forms at least one portion of the side surface.

8. The electronic device of claim 6, wherein the electronic device comprises a display,

wherein the outer housing comprises:

a front surface facing in the same direction as the display does;

a back surface facing an opposite direction of the front surface; and

a side surface connecting the first surface and the back surface, and

wherein the portion forms at least one portion of one or more of the front surface and the back surface.

9. The electronic device of claim 1, wherein the recesses form hairlines formed in a substantially same direction.

10. The electronic device of claim 1, wherein the injection preform has a uniform thickness.

11. The electronic device of claim 1, wherein a rib is provided on an inner surface of the injection preform, and the rib is formed to be 50% or less of a thickness of the injection preform.

12. The electronic device of claim 1, wherein the deposition layer is formed of a non-conductive material.

13. A case for an electronic device, comprising:

an injection preform having a uniform thickness, partially having a rib on an inner surface thereof, and having a plurality of recesses on an outer surface thereof, wherein the outer surface of the injection preform is processed to be roughened through a plasma process;

a deposition Layer formed of a non-conductive metallic material deposited on the plasma-processed surface of the injection preform wherein a surface of the deposition layer comprises a plurality of recesses; and

a paint layer formed on the deposition layer and having a flat surface,

wherein a thickness of the rib is set to 50% or less of a thickness of the injection preform, and the deposition layer is provided to directly contact on the surface of the injection preform to express a texture pattern, wherein the plurality of recesses of the surface of the deposition layer have substantially identical shapes to the plurality of recesses of the of the injection preform,

wherein the injection preform includes a first injection-molded portion and a second injection-molded portion, the first injection-molded portion corresponds to a side of the electronic device, and the second injection-molded portion extends from the first injection-molded portion to an inside of the electronic device and includes a coupling member to couple to the electronic device.

14. A case for an electronic device, comprising:

a front surface case; and

at least one case coupled to a rear surface of the front surface case,

wherein at least one of the front surface case and the case comprises;

an injection preform forming a plurality of recesses on a surface thereof, wherein the surface of the injection preform is processed to be roughened through a plasma process;

a deposition layer deposited on the plasma-processed surface of the injection preform; and

a paint layer formed on the deposition layer and having a flat surface, and

wherein the plurality of recesses of the surface of the deposition layer have substantially identical shapes to the plurality of recesses of the surface of the injection preform,

wherein the injection preform includes a first injection-molded portion and a second injection-molded portion, the first injection-molded portion corresponds to a side of the electronic device and the second injection-molded portion extends from the first injection-molded portion to an inside of the electronic device and includes a coupling member to couple to the electronic device.

15. The case of claim 14, wherein the at least one case comprises a side surface case coupled to the rear surface of the front surface case, and a battery cover covering a rear surface of the side surface case, and the side surface case is exposed to a side surface of the electronic device.

16. The case of claim 15, wherein the injection preform of the side surface case comprises:

the first injection-molded portion located between the front surface case and the battery cover of the electronic device, and exposed to the outside to form a side surface of the electronic device; and

the second injection-molded portion extending from the first injection-molded portion, and coupled to the rear surface of the front surface case, and

wherein the recess is formed on a surface of the first injection-molded portion, and the deposition layer is provided on a surface of the first injection-molded portion.

17. The case of claim 16, wherein the first injection-molded portion is formed through seamless injection-molding.

18. The case of claim 17, further comprising:

a rib protruding from an inner surface of the first injection-molded portion,

wherein the first injection-molded portion has a uniform thickness, and a thickness of the rib is 50% or less of the thickness of the first injection-molded portion.

19. The case of claim 15, wherein the injection preform comprises:

a third injection-molded portion provided at a periphery of a display of the electronic device and provided at a portion exposed to the outside; and

a fourth injection-molded portion extending from the third injection-molded portion and coupled to a side case of the electronic device,

wherein the recess is formed in the third injection-molded portion and the deposition layer is provided on a surface of the third injection-molded portion.

20. The case of claim 19, wherein the third injection-molded portion has a uniform thickness and is formed through seamless injection-molding.

21. The case of claim 15, wherein one surface of the injection preform of the battery cover is entirely exposed to the outside, and a rib for attachment and detachment of the battery cover is provided on an inner surface of the injection preform.

22. The case of claim 21, wherein the injection preform of the battery cover has a uniform thickness, and the rib is formed along a periphery of an inner surface of the injection preform and has a thickness of 50% or less of the thickness of the injection preform of the battery cover.