Mounting board, sensor unit, electronic apparatus, and moving body

• US 9,702,890 B2
• Filed: 02/10/2014
• Issued: 07/11/2017
• Est. Priority Date: 03/11/2013
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Saito, Yoshikuni
• Primary Examiner(s): Tran, Binh
• Application Number:
  US14/176,444
• Publication Number:
  US 20140254118A1
• Time in Patent Office: 1,247 Days
• Field of Search: 361760, 361767, 361770, 361777, 361780, 361783, 361800
• CPC Class Codes: G01P 1/006 used for thermal compensation
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/10151 Sensor

Abstract

A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from each other, and to correspond to mounting terminals of the physical quantity sensor. A shield electrode is disposed outside the sensor mounting area.

Claims

1. A sensor unit comprising:

a physical quantity sensor; and

a mounting board holding the physical quantity sensor, the mounting board including;

a board main body with a top surface, the top surface of the board main body having;

a sensor mounting area that is in a rectangular shape, the physical quantity sensor being mounted in the sensor mounting area;

a first ring area that is located outside of the sensor mounting area in a plan view so as to surround the sensor mounting area; and

a second ring area that is provided between a peripheral of the top surface of the board main body and an outer circumference of the first ring area so that the second ring area surrounds the first ring area in the plan view;

a plurality of electrodes located on the sensor mounting area along a peripheral of the sensor mounting area, the plurality of electrodes being electrically connected to electrodes of the physical quantity sensor; and

a shield electrode that is located on the second ring area along an outer peripheral of the first ring area,

wherein the shield electrode is connected to a ground potential, and

a first part of the first ring area is wider than the other parts of the first ring area, and a wiring which connects at least one of the plurality of electrodes to another of the plurality of electrodes is provided at the first part of the first ring area.

2. The sensor unit according to claim 1, wherein

at least two of the plurality of electrodes have the same potential.

3. The sensor unit according to claim 2, wherein

the at least two of the plurality of electrodes are connected to each other inside the board main body via a conductive via hole formed along a thickness direction of the board main body.

4. The sensor unit according to claim 1, wherein

the shield electrode surrounds the sensor mounting area in the plan view.

5. The sensor unit according to claim 1, wherein

the shield electrode is laterally shifted from the plurality of electrodes by a distance that is larger than a distance between adjacent two of the plurality of electrodes.

6. An electronic apparatus comprising:

the sensor unit according to claim 1.

7. A moving body comprising:

the sensor unit according to claim 1.

8. A sensor unit comprising:

a physical quantity sensor; and

a mounting board holding the physical quantity sensor, the mounting board including;

a board main body with a top surface, the top surface of the board main body having;

a sensor mounting area that is in a rectangular shape, the physical quantity sensor being mounted in the sensor mounting area;

a first ring area that is located outside of the sensor mounting area in a plan view so as to surround the sensor mounting area; and

a second ring area that is provided between a peripheral of the top surface of the board main body and an outer circumference of the first ring area so that the second ring area surrounds the first ring area in the plan view;

a plurality of electrodes located on the sensor mounting area along a peripheral of the sensor mounting area, the plurality of electrodes being electrically connected to electrodes of the physical quantity sensor; and

a wiring that is located outside of the sensor mounting area in the plan view,

wherein at least two of the plurality of electrodes have the same potential,

the at least two of the plurality of electrodes are electrically connected to each other via the wiring, and

a first part of the first ring area is wider than the other parts of the first ring area, and the wiring is provided at the first part of the first ring area.

9. The sensor unit according to claim 8, wherein

the wiring includes a conductive via hole formed along the thickness direction of the board main body, and

the at least two of the plurality of electrodes are connected to each other inside the board main body via the conductive via hole.

10. The sensor unit according to claim 9, wherein

at least one of the conductive via holes is disposed outside the sensor mounting area in the planar view.

11. The sensor unit according to claim 8, wherein

a shield electrode is located on the second ring area along an outer peripheral of the first ring area and outside of the wiring in the plan view.

12. An electronic apparatus comprising:

the sensor unit according to claim 8.

13. A moving body comprising:

the sensor unit according to claim 8.