Electronic device with die being sunk in substrate

• US 9,704,794 B2
• Filed: 06/08/2015
• Issued: 07/11/2017
• Est. Priority Date: 06/17/2014
• Status: Active Grant

• Current Assignee: STMicroelectronics International N.V. (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Fontana, Fulvio Vittorio, Graziosi, Giovanni
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): JEAN BAPTISTE, WILNER
• Application Number:
  US14/733,209
• Publication Number:
  US 20150364409A1
• Time in Patent Office: 764 Days
• Field of Search: 257692
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92144 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect

Abstract

An electronic device includes a circuit integrated on a die having front and back surfaces with die terminals on the front surface. The die is embedded in a package including substrate of thermally conductive material with front and back surfaces and a through-hole. The die is sunk in the through-hole. A first insulating material layer covers the die front surface and the package front surface with first windows for accessing die terminals. Package terminals and package track are arranged on the first insulating layer. A second insulating material layer covers the first insulating layer and the package tracks with second windows for accessing the package terminals.

Claims

1. An electronic device, comprising:

at least one circuit being integrated on a die, the die having a die front surface and a die back surface opposed to each other, one or more die lateral surfaces extending between the die front surface and the die back surface, and one or more die terminals on the die front surface for accessing the integrated circuit;

a package including a package substrate of thermally conductive material having a package front surface and a package back surface opposed to each other and at least one through-hole crossing the package substrate between the package front surface and the package back surface;

wherein the die is sunk in the through-hole with the die front surface and the die back surface in correspondence to the package front surface and to the package back surface, respectively;

a first insulating layer of electrically insulating material covering the die front surface and the package front surface with one or more first windows each one for accessing a corresponding one of the die terminals;

one or more package terminals;

one or more package tracks of electrically conductive material arranged on the first insulating layer, each package track coupling a corresponding one of the package terminals with at least a corresponding one of the die terminals;

a second insulating layer of electrically insulating material covering the first insulating layer and the package tracks with one or more second windows each one for accessing a corresponding one of the package terminals; and

a filler of elastic and thermally conductive material coupling the die lateral surfaces with side walls of the through-hole of the package substrate, the elastic and thermally conductive material conducting heat from the die to the package substrate.

2. The electronic device according to claim 1, wherein the package terminals are arranged along one or more frames in correspondence to a border of the package, and wherein the package further exposes at least one dissipation element of thermally conductive material inside the frames, the dissipation element being coupled with the die front surface through a further first window and a further second window of the first insulating layer and of the second insulating layer, respectively.

3. The electronic device according to claim 1, wherein the package terminals are arranged in a matrix on a prevalent portion of the package.

4. The electronic device according to claim 1, wherein the package further comprises a cover element of thermally conductive material covering the die back surface and the package back surface.

5. The electronic device according to claim 4, wherein the cover element is attached on the package back surface, the cover element being spaced apart from the die back surface thereby defining a sealed cavity for the die.

6. The electronic device of claim 1, further comprising:

an electronic board including a board substrate of electrically insulating material having a main surface, one or more board tracks of electrically conductive material arranged in at least one layer embedded in the board substrate and a recess extending from the main surface to expose corresponding portions of the board tracks;

wherein said package is housed in said recess with the package terminals in electrical connection with the exposed corresponding portions of the board tracks.

7. The electronic device according to claim 6, wherein the package further comprises a cover element of thermally conductive material covering the die back surface and the package back surface, said cover element having a projecting portion projecting outside the package substrate and extending over said main surface of the board substrate.

8. The electronic device according to claim 7, further comprising at least one dissipation layer of thermally conductive material arranged on the main surface at least in part around said recess.

9. The electronic device according to claim 8, wherein the projecting portion of the cover element is attached on the dissipation layer around the recess.

10. The electronic device of claim 1 wherein the filler of elastic and thermally conductive material has a thermal conductivity greater than 0.5 W/mK.

11. The electronic device of claim 10 wherein the filler of elastic and thermally conductive material has a thermal conductivity greater than 1 W/mK.

12. The electronic device of claim 1 wherein the filler of elastic and thermally conductive material is silicone.

13. An electronic device, comprising:

at least one integrated circuit die having a die front surface, a die back surface opposed to the die front surface and a die edge surface extending between the die front surface and the die back surface and further having die electrical terminals on the die front surface;

a package substrate made of a thermally conductive material having a package front surface and a package back surface opposed to each other and further having a through-hole crossing the package substrate between the package front surface and the package back surface;

wherein the integrated circuit die is positioned within the through-hole;

a filler of elastic and thermally conductive material coupling the die edge surface to a wall of the through-hole, the filler of elastic and thermally conductive material conducting heat from the integrated circuit die to the package substrate;

a first insulating layer of electrically insulating material covering at least a portion of the die front surface and the package front surface, said first insulating layer including first windows for accessing corresponding die electrical terminals;

package electrical terminals arranged on the first insulating layer;

package electrical tracks arranged on the first insulating layer for making electrical connections between the die electrical terminals and the package electrical terminals;

a second insulating layer of electrically insulating material covering the first insulating layer and the package tracks, said second insulating layer including second windows for accessing corresponding package electrical terminals; and

wherein the package substrate and the filler of elastic and thermally conductive material fully support the at least one integrated circuit die.

14. The electronic device of claim 13, wherein the die back surface is coplanar with the package back surface.

15. The electronic device of claim 14, further comprising a cover element made of a thermally conductive material covering the coplanar die back surface and the package back surface.

16. The electronic device of claim 15, wherein the cover element is attached on the package back surface, the cover element being spaced apart from the die back surface thereby defining a sealed cavity for the die.

17. The electronic device of claim 13, wherein the die front surface is recessed with respect to the package front surface.

18. The electronic device of claim 13, wherein the die front surface further includes a heat dissipation terminal, and wherein the first windows are further for accessing the heat dissipation terminal.

19. The electronic device of claim 18, wherein the second windows are further for accessing the heat dissipation terminal.

20. The electronic device of claim 13 wherein the filler of elastic and thermally conductive material is silicone.

22. The electronic device of claim 13, wherein the electronic device does not include an additional support structure adhered to the die back surface.

21. An electronic device, comprising:

at least one circuit being integrated on a die, the die having a die front surface and a die back surface opposed to each other and one or more die terminals on the die front surface for accessing the integrated circuit;

a package including a package substrate of thermally conductive material having a package front surface and a package back surface opposed to each other and at least one through-hole crossing the package substrate between the package front surface and the package back surface;

wherein the die is sunk in the through-hole with the die front surface and the die back surface in correspondence to the package front surface and to the package back surface, respectively;

a first insulating layer of electrically insulating material covering the die front surface and the package front surface with one or more first windows each one for accessing a corresponding one of the die terminals;

one or more package terminals;

one or more package tracks of electrically conductive material arranged on the first insulating layer, each package track coupling a corresponding one of the package terminals with at least a corresponding one of the die terminals;

a second insulating layer of electrically insulating material covering the first insulating layer and the package tracks with one or more second windows each one for accessing a corresponding one of the package terminals; and

a cover element of thermally conductive material covering the die back surface and the package back surface, the cover element being attached on the package back surface and disposed spaced apart from the die back surface thereby defining a sealed cavity for the die.