Multi-wafer based light absorption apparatus and applications thereof
First Claim
1. A multi-wafer based semiconductor light absorption structure comprising:
- a first wafer bonded with a second wafer;
a light absorption region located in the first wafer;
a contact region located in the first wafer, immediately above the light absorption region and in physical contact with the light absorption region; and
a bonding interface between the first wafer and the second wafer, the bonding interface located below the light absorption region and not in physical contact with the light absorption region.
3 Assignments
0 Petitions
Accused Products
Abstract
Structures and techniques introduced here enable the design and fabrication of photodetectors (PDs) and/or other electronic circuits using typical semiconductor device manufacturing technologies meanwhile reducing the adverse impacts on PDs'"'"' performance. Examples of the various structures and techniques introduced here include, but not limited to, a pre-PD homogeneous wafer bonding technique, a pre-PD heterogeneous wafer bonding technique, a post-PD wafer bonding technique, their combinations, and a number of mirror equipped PD structures. With the introduced structures and techniques, it is possible to implement PDs using typical direct growth material epitaxy technology while reducing the adverse impact of the defect layer at the material interface caused by lattice mismatch.
9 Citations
21 Claims
-
1. A multi-wafer based semiconductor light absorption structure comprising:
-
a first wafer bonded with a second wafer; a light absorption region located in the first wafer; a contact region located in the first wafer, immediately above the light absorption region and in physical contact with the light absorption region; and a bonding interface between the first wafer and the second wafer, the bonding interface located below the light absorption region and not in physical contact with the light absorption region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A light absorption apparatus comprising:
-
a contact region; a light absorption region beneath the contact region, wherein light is incident from the contact region traveling along a first direction toward the light absorption region, the light absorption region having a smaller width than the contact region; and an optical mirror structure coupled to the light absorption region, such that the light is incident through the contact region and the light absorption region to the optical mirror structure and reflected back to the light absorption region, wherein the optical mirror structure includes a plurality of mirror layers, at least two mirror layers being separated by a bonding interface between two wafers. - View Dependent Claims (20, 21)
-
Specification