Method of forming a disc spring-based energy harvesting device

• US 9,705,430 B2
• Filed: 03/14/2013
• Issued: 07/11/2017
• Est. Priority Date: 02/08/2007
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Malkin, Matthew C., Pena, Gerardo
• Primary Examiner(s): Tugbang, A. Dexter
• Application Number:
  US13/827,235
• Publication Number:
  US 20130207521A1
• Time in Patent Office: 1,580 Days
• CPC Class Codes: H02N 2/021 using intermittent driving, e.g. step motors, piezoleg motors
• CPC Class Codes: H02N 2/186 Vibration harvesters
• CPC Class Codes: H02N 2/22 Methods relating to manufacturing, e.g. assembling, calibration
• CPC Class Codes: H10N 30/03 Assembling devices that include piezoelectric or electrostrictive parts
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings
• CPC Class Codes: H10N 30/886 Additional mechanical prestressing means, e.g. springs
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method of forming an energy harvesting device comprises supporting an outer peripheral edge of a disc spring using a support element that allows oscillations of the disc spring. A first preload force is applied to the disc spring and directed along its axial center. During application of the first preload force, a piezoelectric material is fixedly secured with a surface of the disc spring. A second preload force is applied to the disc spring to thereby provide a predetermined reduction of a stiffness of the disc spring. The reduction of the stiffness corresponds to an increased sensitivity to low-frequency components of vibrational energy received by the energy harvesting device.

Claims

1. A method of forming an energy harvesting device for harvesting vibrational energy from an external vibration structure, the method comprising:

supporting, using a support element, an outer peripheral edge of a first disc spring, wherein the support element is configured to allow oscillations of the first disc spring relative to the support element, the oscillations responsive to vibrational energy received from the external vibration structure;

applying a first preload force to the first disc spring directed along an axial center of the first disc spring;

fixedly securing, during application of the first preload force, a first piezoelectric material with a surface of the first disc spring; and

applying a second preload force to the first disc spring to thereby provide a predetermined reduction of a stiffness of the first disc spring, wherein the reduction of the stiffness corresponds to an increased sensitivity to low-frequency components of the vibrational energy received from the external vibration structure.

2. The method of claim 1, wherein the support element comprises a circumferential support ring.

3. The method of claim 1, wherein applying the first preload force is performed using a fastening assembly comprising a threaded fastener coupled with a threaded nut,

wherein the threaded fastener extends through an opening formed at the axial center of the first disc spring, and

wherein applying the second preload force comprises tightening the threaded fastener with the threaded nut using a predetermined number of turns.

4. The method of claim 3, further comprising:

securing, using the fastening assembly, a second disc spring with the support element, the second disc spring arranged with an opposing relationship to the first disc spring,

wherein tightening the threaded fastener with the threaded nut operates to apply the second preload force to the first disc spring contemporaneously with applying a third preload force to the second disc spring.

5. The method of claim 4, wherein each of the first disc spring and the second disc spring define an respective opening at an axial center thereof, and

wherein the threaded fastener extends through the openings of the first disc spring and the second disc spring.

6. The method of claim 1, wherein fixedly securing the first piezoelectric material with the surface of the first disc spring comprises bonding the surface with at least a first portion of an undersurface of the first piezoelectric material using a first adhesive compound.

7. The method of claim 6, wherein the first adhesive compound comprises an electrically conductive adhesive compound.

8. The method of claim 7, wherein fixedly securing the first piezoelectric material to the surface of the first disc spring further comprises bonding the surface with at least a second portion of the undersurface using a second, electrically non-conductive adhesive compound.

9. The method of claim 1, further comprising:

arranging a second disc spring with an opposing relationship to the first disc spring; and

supporting the second disc spring using the support element.

10. The method of claim 9, further comprising:

applying a third preload force to the second disc spring.

11. The method of claim 9, wherein the support element comprises a circumferential support ring contacting each of the first disc spring and the second disc spring only along a respective outer peripheral edge.

12. The method of claim 9, further comprising:

fixedly securing a second piezoelectric material to a surface of the second disc spring,

wherein applying the second preload force to the first disc spring comprises applying a third preload force to the second disc spring to thereby provide a predetermined reduction of a stiffness of the second disc spring.

13. The method of claim 9, wherein the first disc spring and the second disc spring share a common diameter, the method further comprising:

arranging the first disc spring and the second disc spring such that axial centers of the first disc spring and the second disc spring are aligned along a common axis.

14. The method of claim 1, wherein the support element comprises a circumferential support ring coupled with a support assembly distributed among a plurality of discrete locations along the circumferential support ring, and

wherein the support assembly supports the outer peripheral edge of the first disc spring by magnet pairs in a non-contact arrangement by repelling magnetic forces of the magnet pairs.