Hybrid infrared sensor array having heterogeneous infrared sensors
First Claim
1. An infrared sensor assembly comprising:
- an array of infrared sensors, the array comprising;
a plurality of microbolometers configured to image a scene, andat least one non-bolometric sensor configured to detect infrared radiation from at least a portion of the scene, the at least one non-bolometric sensor being provided among the array in place of one or more microbolometers; and
a substrate coupled to the array, the substrate comprising;
a readout integrated circuit (ROIC) configured to provide signals from the microbolometers corresponding to a captured infrared image of the scene, the captured infrared image containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor among the array, andan output circuit configured to provide signals from the at least one non-bolometric sensor,wherein the infrared sensor assembly is configured to generate a blended infrared image that has the at least one blind spot filled based on the captured infrared image and the signals from the at least one non-bolometric sensor.
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Abstract
Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.
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Citations
19 Claims
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1. An infrared sensor assembly comprising:
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an array of infrared sensors, the array comprising; a plurality of microbolometers configured to image a scene, and at least one non-bolometric sensor configured to detect infrared radiation from at least a portion of the scene, the at least one non-bolometric sensor being provided among the array in place of one or more microbolometers; and a substrate coupled to the array, the substrate comprising; a readout integrated circuit (ROIC) configured to provide signals from the microbolometers corresponding to a captured infrared image of the scene, the captured infrared image containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor among the array, and an output circuit configured to provide signals from the at least one non-bolometric sensor, wherein the infrared sensor assembly is configured to generate a blended infrared image that has the at least one blind spot filled based on the captured infrared image and the signals from the at least one non-bolometric sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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receiving, at an array of infrared sensors, infrared radiation from a scene, wherein the array comprises a plurality of microbolometers and at least one non-bolometric sensor, the at least one non-bolometric sensor being provided among the array in place of one or more of the plurality of microbolometers; providing, by a readout integrated circuit (ROIC) communicatively coupled to the microbolometers, infrared image data representing an infrared image of the scene, the infrared image containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor on the array; providing, by an output circuit communicatively coupled to the at least one non-bolometric sensor, temperature information associated with the scene, wherein the ROIC and the output circuit are provided on a substrate; and generating a blended infrared image data representing a blended infrared image that has the at least one blind spot filled, based on the infrared image data and the temperature information. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of providing a hybrid infrared sensor assembly, the method comprising:
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fabricating microbolometers to form a focal plane array (FPA), the FPA having at least one portion without microbolometers, the at least one portion being provided among the FPA in place of one or more of the microbolometers; fabricating at least one non-bolometric sensor on the at least one portion of the FPA in place of the one or more of the microbolometers; providing a readout integrated circuit (ROIC) electrically coupled to the microbolometers to generate output signals corresponding to an image of infrared radiation incident on the microbolometers, the image of infrared radiation containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor on the FPA; and providing bond pads electrically connected to the at least one non-bolometric sensor and configured to form electrical connection with an external device, wherein the external device is configured to generate a blended infrared image that has the at least one blind spot filled based on the image of infrared radiation and signals from the at least one non-bolometric sensor. - View Dependent Claims (19)
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Specification