System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
First Claim
1. A computing system for sensing physical status data using MEMS (Micro Electro-Mechanical System) devices, the system comprising:
- an executable memory configured to store a plurality of executable code;
one or more application processors coupled to the memory, wherein the one or more application processors are configured to execute the plurality of executable code;
one or more baseband processors coupled to the one or more application processors, wherein the one or more baseband processors are configured for at least a wireless communication protocol; and
a MEMS system coupled to the application processor, wherein the MEMS system comprises;
the MEMS devices configured to sense physical perturbations, wherein the MEMS devices includes at least a MEMS transducer apparatus comprising;
a substrate member having a surface region,a movable base having at least one intermediate cavity disposed in an intermediate portion of the movable base structure, the at least one intermediate cavity having a cavity surface region;
at least one intermediate anchor structure spatially disposed within the at least one intermediate cavity, the intermediate anchor structure(s) being coupled to at least one portion of the surface region;
at least one intermediate spring structure coupled to at least one portion of the cavity surface region, the intermediate spring structure(s) being coupled to the intermediate anchor structure(s), the spring structure(s) being spatially oriented to be substantially 45 degrees or substantially (pi/4) radians to edges of a die; and
at least one capacitor element, the capacitor element(s) being spatially disposed within a vicinity of the intermediate cavity; and
one or more sensor processors coupled to the MEMS devices, wherein the one or more sensor processors are configured to provide physical status data to the one or more application processors in response to the physical perturbations sensed by the MEMS devices;
wherein the one or more application processors are also configured to execute the plurality of executable code in response to the physical status data.
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Accused Products
Abstract
A sensor processor system is provided on a platform including a semiconductor substrate. The system has multiple integrated subsystems including a micro controller unit provided on one or more first regions of the semiconductor substrate. The subsystems also include an array of programmable memory provided on one or more second regions of the semiconductor substrate, among other elements. The subsystems also include one or more MEMS devices operably coupled to the micro controller unit. In one or more embodiments, an application processor is coupled to the semiconductor substrate and, optionally, a baseband processor is coupled to the semiconductor substrate.
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Citations
12 Claims
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1. A computing system for sensing physical status data using MEMS (Micro Electro-Mechanical System) devices, the system comprising:
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an executable memory configured to store a plurality of executable code; one or more application processors coupled to the memory, wherein the one or more application processors are configured to execute the plurality of executable code; one or more baseband processors coupled to the one or more application processors, wherein the one or more baseband processors are configured for at least a wireless communication protocol; and a MEMS system coupled to the application processor, wherein the MEMS system comprises; the MEMS devices configured to sense physical perturbations, wherein the MEMS devices includes at least a MEMS transducer apparatus comprising; a substrate member having a surface region, a movable base having at least one intermediate cavity disposed in an intermediate portion of the movable base structure, the at least one intermediate cavity having a cavity surface region; at least one intermediate anchor structure spatially disposed within the at least one intermediate cavity, the intermediate anchor structure(s) being coupled to at least one portion of the surface region; at least one intermediate spring structure coupled to at least one portion of the cavity surface region, the intermediate spring structure(s) being coupled to the intermediate anchor structure(s), the spring structure(s) being spatially oriented to be substantially 45 degrees or substantially (pi/4) radians to edges of a die; and at least one capacitor element, the capacitor element(s) being spatially disposed within a vicinity of the intermediate cavity; and one or more sensor processors coupled to the MEMS devices, wherein the one or more sensor processors are configured to provide physical status data to the one or more application processors in response to the physical perturbations sensed by the MEMS devices; wherein the one or more application processors are also configured to execute the plurality of executable code in response to the physical status data. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification