Systems and methods for automated assembly of dynamic magnetic stripe communications devices

• US 9,710,745 B1
• Filed: 02/08/2013
• Issued: 07/18/2017
• Est. Priority Date: 02/09/2012
• Status: Active Grant

• Current Assignee: Dynamics Inc.
• Original Assignee: Dynamics Inc.
• Inventors: O'Shea, Norman E.
• Primary Examiner(s): Goff, John
• Application Number:
  US13/762,497
• Time in Patent Office: 1,621 Days
• Field of Search: 156265, 156297, 156300, 156301, 156302, 156303, 156298, 156324, 1562722, 1562755, 1562757, 156295, 156242, 156245, 427300, 235487, 235488
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/1054 Regulating the dimensions of the laminate, e.g. by adjusting the nip or platen gap
• CPC Class Codes: B32B 37/226 Laminating sheets, panels or inserts between two continuous plastic layers
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web

Abstract

An automated conveyor system extends a continuous layer of plastic onto a moving conveyor. A pair of damming strips may be applied to the continuous layer of plastic as the conveyor advances. A liquid material may be sprayed between the damming strips and electronic assemblies may be robotically picked and placed onto the continuous layer of plastic between the damming strips and on top of the liquid material. Additional liquid material may be sprayed on top of the electronic assemblies as the conveyor moves. A continuous top plastic layer may be extended on top of the electronic assemblies, while a roller compresses the electronic assemblies between the top plastic layer and bottom plastic layer. A transparent clamp holds a portion of the compressed sub-assembly in place while the sub-assembly is cured. A sheering station sheers the sub-assembly as the conveyor indexes.

Claims

1. A method comprising:

extending a portion of a first continuous sheet of plastic onto a moving conveyor;

robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;

applying a first material onto said electronic assembly;

extending a portion of a second continuous sheet of plastic over said electronic assembly;

curing at least a portion of said first material applied onto said electronic assembly;

applying a plurality of strips of damming material lengthwise, in parallel, on said portion of said first continuous sheet of plastic; and

applying a second material between at least two of said strips.

2. The method of claim 1, further comprising:

moving, by said moving conveyor, said electronic assembly to a plurality of indexed positions.

3. The method of claim 1, further comprising:

moving, by said moving conveyor, a plurality of electronic assemblies to a plurality of indexed positions.

4. The method of claim 1, further comprising:

moving, by said moving conveyor, eight electronic assemblies to a plurality of indexed positions.

5. The method of claim 1,

wherein said applying a second material between at least two of said strips includes spraying a second liquid material between at least two of said strips.

6. The method of claim 1,

wherein said applying a second material between at least two of said strips includes spraying a second liquid material between at least two of said strips, and

wherein said applying a first material onto said electronic assembly includes spraying a first liquid material onto said electronic assembly.

7. The method of claim 1, further comprising:

pressing, by a roller, said portion of said first continuous sheet of plastic, said electronic assembly, said first material applied onto said electronic assembly, and said portion of said second continuous sheet of plastic.

8. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic with a transparent clamp mechanism.

9. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic with a translucent clamp mechanism.

10. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly to create a compressed thickness of approximately 0.029 inches.

11. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly,

wherein said curing is performed during said clamping.

12. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly with a translucent clamping mechanism,

wherein said curing includes passing ultraviolet light through said clamping mechanism.

13. The method of claim 1, further comprising:

clamping said portion of said first continuous sheet of plastic and said portion of said second continuous sheet of plastic onto said electronic assembly with a transparent clamping mechanism,

wherein said curing includes passing ultraviolet light through said clamping mechanism.

14. The method of claim 1, further comprising:

peeling away a backing strip from one of the plurality of strips of damming material prior to said applying a plurality of strips of damming material.

15. A method comprising:

extending a portion of a first continuous sheet of plastic onto a moving conveyor;

robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;

applying a first material onto said electronic assembly;

extending a portion of a second continuous sheet of plastic over said electronic assembly;

curing at least a portion of said first material applied onto said electronic assembly;

applying a plurality of strips of damming material on said portion of said first continuous sheet of plastic; and

applying a second material between at least two of said strips,

wherein said robotically placing includes placing said electronic assembly between said at least two strips after said applying said second material between at least two of said strips.

16. The method of claim 15,

wherein said applying a second material between at least two of said strips includes applying a liquid material between at least two of said strips, and

wherein said robotically placing includes placing said electronic assembly on said liquid material.

17. The method of claim 15,

wherein said applying a second material between at least two of said strips includes applying a liquid material between at least two of said strips,

wherein said robotically placing includes placing said electronic assembly on said liquid material, and

wherein said applying a first material onto said electronic assembly occurs after said applying a liquid material between at least two strips and before said extending a portion of a second continuous sheet of plastic over said electronic assembly.

18. A method comprising:

extending a portion of a first continuous sheet of plastic onto a moving conveyor;

robotically placing an electronic assembly onto said portion of said first continuous sheet of plastic;

applying a material onto said electronic assembly;

extending a portion of a second continuous sheet of plastic over said electronic assembly;

curing at least a portion of said material; and

applying a plurality of strips of damming material lengthwise, in parallel, on said portion of said first continuous sheet of plastic.

19. The method of claim 18, further comprising:

moving, by said moving conveyor, one or more electronic assemblies to one or more indexed positions.

20. The method of claim 18, further comprising:

spraying a liquid material between at least two of said strips.

21. The method of claim 18, further comprising:

spraying a first liquid material between at least two of said strips,

wherein said applying a material onto said electronic assembly includes spraying a second liquid material onto said electronic assembly.

22. The method of claim 18, further comprising:

applying a second material between at least two of said strips,

wherein said robotically placing includes placing said electronic assembly between said at least two strips after said applying a second material between at least two of said strips.

23. The method of claim 18, further comprising:

applying a liquid material between at least two of said strips,

wherein said robotically placing includes placing said electronic assembly on said liquid material.

24. The method of claim 18, further comprising:

applying a liquid material between at least two of said strips,

wherein said robotically placing includes placing said electronic assembly on said liquid material, and

wherein said applying a material onto said electronic assembly occurs after said applying a liquid material between at least two strips and before said extending a portion of a second continuous sheet of plastic over said electronic assembly.