Curved RF electrode for improved Cmax
First Claim
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1. A method of manufacturing a MEMS DVC, comprising:
- forming one or more electrodes over a substrate;
depositing a dielectric layer over the electrodes and the substrate;
chemical mechanically polishing the dielectric layer to expose the one or more electrodes, wherein the chemical mechanical polishing results in a convex upper surface of the one or more electrodes; and
forming a plate electrode over the one or more electrodes, wherein the plate electrode has a bottom surface having a concave portion overlying the convex upper surface of the one or more electrodes.
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Abstract
The present invention generally relates to a MEMS device and a method of manufacture thereof. The RF electrode, and hence, the dielectric layer thereover, has a curved upper surface that substantially matches the contact area of the bottom surface of the movable plate. As such, the movable plate is able to have good contact with the dielectric layer and thus, good capacitance is achieved.
6 Citations
12 Claims
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1. A method of manufacturing a MEMS DVC, comprising:
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forming one or more electrodes over a substrate; depositing a dielectric layer over the electrodes and the substrate; chemical mechanically polishing the dielectric layer to expose the one or more electrodes, wherein the chemical mechanical polishing results in a convex upper surface of the one or more electrodes; and forming a plate electrode over the one or more electrodes, wherein the plate electrode has a bottom surface having a concave portion overlying the convex upper surface of the one or more electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification