Semiconductor package assembly
First Claim
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1. A semiconductor package assembly, comprising:
- a semiconductor die;
a first molding compound covering a back surface of the semiconductor die;
a redistribution layer (RDL) structure disposed on a front surface of the semiconductor die, wherein the semiconductor die is coupled to the RDL structure;
a second molding compound disposed on the front surface of the semiconductor die and embedded in the redistribution layer (RDL) structure;
a passive device disposed on the second molding compound and coupled to the semiconductor die; and
conductive structures disposed on a first surface of the redistribution layer (RDL) structure, the first surface facing away from the semiconductor die, wherein the conductive structures are coupled to the redistribution layer (RDL) structure, and a thickness of the passive device is less than a diameter of the conductive structures as viewed in vertical cross-section.
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Abstract
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a semiconductor die. A first molding compound covers a back surface of the semiconductor die. A redistribution layer (RDL) structure is disposed on a front surface of the semiconductor die. The semiconductor die is coupled to the RDL structure. A second molding compound is disposed on the front surface of the semiconductor die and embedded in the RDL structure. A passive device is disposed on the second molding compound and coupled to the semiconductor die.
11 Citations
23 Claims
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1. A semiconductor package assembly, comprising:
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a semiconductor die; a first molding compound covering a back surface of the semiconductor die; a redistribution layer (RDL) structure disposed on a front surface of the semiconductor die, wherein the semiconductor die is coupled to the RDL structure; a second molding compound disposed on the front surface of the semiconductor die and embedded in the redistribution layer (RDL) structure; a passive device disposed on the second molding compound and coupled to the semiconductor die; and conductive structures disposed on a first surface of the redistribution layer (RDL) structure, the first surface facing away from the semiconductor die, wherein the conductive structures are coupled to the redistribution layer (RDL) structure, and a thickness of the passive device is less than a diameter of the conductive structures as viewed in vertical cross-section. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package assembly, comprising:
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a semiconductor die; a first molding compound disposed on a first surface of the semiconductor die; a redistribution layer (RDL) structure disposed on a second surface opposite the first surface of the semiconductor die; a second molding compound disposed on the second surface of the semiconductor die and embedded in the redistribution layer (RDL) structure, wherein the second molding compound is separated from the first molding compound through the redistribution layer (RDL) structure; a passive device disposed on the second molding compound and coupled to the semiconductor die; and conductive structures disposed on a first surface of the redistribution layer (RDL) structure, the first surface facing away from the semiconductor die, wherein the conductive structures are coupled to the redistribution layer (RDL) structure, and a thickness of the passive device is less than a diameter of the conductive structures as viewed in vertical cross-section. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor package assembly, comprising:
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a semiconductor die; a first molding compound in contact with a first surface of the semiconductor die; a redistribution layer (RDL) structure covering a first portion of a second surface opposite the first surface of the semiconductor die; a second molding compound covering a second portion of the second surface of the semiconductor die and embedded in the RDL structure; a passive device covering the second portion of the second surface of the semiconductor die, wherein the second molding compound is disposed between the semiconductor die and the passive device; and conductive structures disposed on a first surface of the redistribution layer (RDL) structure, the first surface facing away from the semiconductor die, wherein the conductive structures are coupled to the redistribution layer (RDL) structure, and a thickness of the passive device is less than a diameter of the conductive structures as viewed in vertical cross-section. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification