Illumination device

• US 9,711,490 B2
• Filed: 07/25/2014
• Issued: 07/18/2017
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Pan, Shyi-Ming, Ho, Chih-Ping, Liao, Chih-Wei
• Primary Examiner(s): Ton, Anabel
• Application Number:
  US14/340,574
• Publication Number:
  US 20140334152A1
• Time in Patent Office: 1,089 Days
• Field of Search: 257 88, 36224902
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 17/10 characterised by specific fastening means or way of fastening F21V17/02 - F21V17/08 take precedence
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 21/14 Adjustable mountings
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/83385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/007 : comprising nitride compounds
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An illumination device includes a supporting base, at least two supports and at least two semiconductor light emitting elements. The supports are disposed on the supporting base and coupled to each other. The semiconductor light emitting elements are respectively coupled to the supports. The semiconductor light emitting element includes a transparent substrate and a light emitting diode (LED) structure. The transparent substrate has a support surface and a second main surface disposed opposite to each other. The LED structure is disposed on the support surface. At least a part of the light emitted from the LED structure may pass through the transparent substrate and emerge from the second main surface.

Claims

1. An illumination device, comprising:

a supporting base having a top surface and a bottom surface opposite to the top surface;

a first support having a slot and disposed on the top surface without penetrating through the bottom surface;

a second support inserting into the slot; and

a semiconductor light emitting element disposed on the first support;

wherein the semiconductor light emitting element comprises;

a substrate, having a support surface and a main surface opposite to the support surface; and

a light emitting diode (LED) structure disposed on the support surface,

wherein the first support has an area which is not smaller than an area of the semiconductor light emitting element.

2. The illumination device of claim 1, wherein the substrate further comprises an extension part disposed on the first support.

3. The illumination device of claim 2, wherein a set of connecting electrodes is disposed on the extension part, and electrically connects the LED structure and the support.

4. The illumination device of claim 1, further comprising a pillar disposed on the supporting base, wherein one of the first supports the second support is disposed on the pillar.

5. The illumination device of claim 4, wherein the pillar has an engaging slot, and one of the first support and the second support is disposed on the pillar via engaging slot.

6. The illumination device of claim 5, wherein the pillar comprises two engaging slots, and the first support and the second support are respectively engaged with the engaging slots and disposed on the pillar.

7. The illumination device of claim 4, wherein the pillar further has a guiding hole disposed on a surface of the pillar.

8. The illumination device of claim 7, wherein the pillar is disposed on the supporting base via the guiding hole.

9. The illumination device of claim 5, wherein the pillar further has a slit disposed on a surface of the pillar, and the slit is extended to the engaging slot.

10. The illumination device of claim 1, wherein the area of the support is 3 times bigger than the area of the semiconductor light emitting element.

11. The illumination device of claim 1, wherein the material of one of the first support and the second support is metal core print circuit board.

12. The illumination device of claim 1, further comprising

a base whereon the supporting base is disposed;

and

a lamp housing disposed on the base to cover the supporting base, the first support, the second support and the semiconductor light emitting elements.

13. An illumination device, comprising:

a supporting base;

a pillar disposed on the supporting base and having an engaging slot;

a support disposed on the pillar via the engaging slot; and

a semiconductor light emitting disposed on the support, wherein the semiconductor light emitting element comprises;

a substrate, having a support surface and a main surface opposite to the support surface; and

a light emitting diode (LED) structure disposed on the support surface.

14. The illumination device of claim 13, wherein the substrate further comprises an extension part disposed on the support.

15. The illumination device of claim 14, wherein a set of connecting electrodes is disposed on the extension part, and electrically connects the LED structure and the support.

16. The illumination device of claim 13, wherein the pillar further has a guiding hole disposed on a surface of the pillar.

17. The illumination device of claim 13, wherein the pillar further has a slit disposed on at least one end surface of the pillar, and the slit is extended to the engaging slot.