Device components with surface-embedded additives and related manufacturing methods

• US 9,713,254 B2
• Filed: 10/02/2015
• Issued: 07/18/2017
• Est. Priority Date: 08/07/2010
• Status: Active Grant

• Current Assignee: TPK Holding Co., Ltd.
• Original Assignee: TPK Holding Co., Ltd.
• Inventors: Srinivas, Arjun Daniel, Robinson, Matthew R., Young, Michael Eugene, Mittal, Alexander Chow
• Primary Examiner(s): Nguyen, Dao H
• Application Number:
  US14/873,567
• Publication Number:
  US 20160029482A1
• Time in Patent Office: 655 Days
• Field of Search: 257434, 257436, 257439, 257E31117, 257E31119, 257E31127, 257E21449, 345174, 136243, 136246, 136251
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H01L 31/0481 characterised by the composition of the encapsulation material
• CPC Class Codes: H01L 31/05 Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells electrodes H01L31/0224; electrical interconnection of thin film solar cells formed on a common substrate H01L31/046; particular structures for electrical interconnecting of adjacent thin film solar cells in the module H01L31/0465; electrical interconnection means specially adapted for electrically connecting two or more PV modules H02S40/36
• CPC Class Codes: H01L 31/055 where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0302 Properties and characteristics in general
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2201/0364 Conductor shape
• CPC Class Codes: H05K 2201/10977 Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/52 PV systems with concentrators
• CPC Class Codes: Y02E 10/542 Dye sensitized solar cells

Abstract

Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Claims

1. A device comprising:

a first layer;

a second layer; and

an interlayer disposed between the first layer and the second layer, wherein the interlayer includes;

a polymeric film; and

a first type of nano-additives and a second type of nano-additives at least partially embedded into the polymeric film, wherein the first type of nano-additives are completely localized within a first embedding layer of the polymeric film, and wherein the second type of nano-additives are completely localized within a second embedding layer of the polymeric film, wherein the first embedding layer is different from the second embedding layer.

2. The device of claim 1, wherein a thickness of the first embedding layer is less than an overall thickness of the polymeric film, a thickness of the second embedding layer is less than the overall thickness of the polymeric film, and a remainder of the polymeric film is devoid of any of the first type of nano-additives or the second type of nano-additives.

3. The device of claim 2, wherein the thickness of the first embedding layer or the second embedding layer is no greater than 50% of the overall thickness of the polymeric film.

4. The device of claim 1, wherein at least some of the first type of nano-additives or some of the second type of nano-additives partially extend out from a surface of the polymeric film.

5. The device of claim 1, wherein at least some of the first type of nano-additives or some of the second type of nano-additives are fully embedded below a surface of the polymeric film.

6. The device of claim 1, wherein at least one of the first type of nano-additives or the second type of nano-additives are patterned to form an array of interconnects.

7. The device of claim 6, further comprising a metallization that is electrically connected to at least one of the interconnects.

8. The device of claim 1, further comprising a display device, and the first layer, the interlayer, and the second layer are coupled to the display device.

9. The device of claim 1, wherein the first embedding layer and the second embedding layer form a layered arrangement.

10. The device of claim 1, wherein the first type of nano-additives and the second type of nano-additives are different types of nanowires.

11. The device of claim 1, wherein the first type of nano-additives and the second type of nano-additives are different types of nanoparticles.

12. The device of claim 1, wherein the first type of nano-additives are nanowires, and wherein the second type of nano-additives are nanoparticles.

13. The device of claim 1, wherein the a first embedding layer is adjacent to a top embedding surface of the polymeric film, and wherein the second embedding layer is adjacent to a bottom embedding surface of the polymeric film.

14. A touch display comprising:

a first device layer;

an interlayer disposed on the first device layer, the interlayer comprising;

a polymeric film; and

a first type of nano-additives and a second type of nano-additives at least partially embedded into the polymeric film, wherein the first type of nano-additives are completely localized within a first embedding layer of the polymeric film, and wherein the second type of nano-additives are completely localized within a second embedding layer of the polymeric film, wherein the first embedding layer is different from the second embedding layer; and

a second device layer disposed on the interlayer.

15. The touch display of claim 14, wherein the second device layer fully covers the first type of nano-additives and the second type of nano-additives.

16. The touch display of claim 14, wherein the first type of nano-additives and the second type of nano-additives are partially exposed from the second device layer.

17. The touch display of claim 14, wherein the first device layer is an optically clear adhesive layer.

18. The touch display of claim 14, wherein at least one of the first type of nano-additives or the second type of nano-additives are patterned to form an array of interconnects.

19. The touch display of claim 14, wherein the first embedding layer is adjacent to a top embedding surface of the polymeric film, and wherein the a second embedding layer is adjacent to a bottom embedding surface of the polymeric film.

20. The touch display of claim 19, wherein the first type of nano-additives and the second type of nano-additives form a projected capacitive touch sensor, a capacitive touch sensor, a resistive touch sensor, or a combination thereof.