Nonvolatile charge trap memory device having a deuterated layer in a multi-layer charge-trapping region
First Claim
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1. A charge trap memory device, comprising:
- a layer of semiconducting material on an insulating layer on a surface of a substrate;
a source region, a drain region, and a channel region electrically connecting the source region and drain region formed in the layer of semiconducting material, wherein the insulating layer separates the channel from the substrate;
a tunnel dielectric layer disposed above the substrate over the channel region; and
a multi-layer charge-trapping region including a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer disposed above the first nitride layer, and a second deuterated layer disposed above the second nitride layer,wherein the second nitride layer comprises a, deuterium-free trap-dense, oxygen-lean nitride layer and includes a majority of charge traps distributed in the multi-layer charge-trapping region, and the first nitride layer comprises a substantially trap-free oxygen-rich nitride layer.
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Abstract
Scaling a charge trap memory device and the article made thereby. In one embodiment, the charge trap memory device includes a substrate having a source region, a drain region, and a channel region electrically connecting the source and drain. A tunnel dielectric layer is disposed above the substrate over the channel region, and a multi-layer charge-trapping region disposed on the tunnel dielectric layer. The multi-layer charge-trapping region includes a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer.
47 Citations
17 Claims
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1. A charge trap memory device, comprising:
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a layer of semiconducting material on an insulating layer on a surface of a substrate; a source region, a drain region, and a channel region electrically connecting the source region and drain region formed in the layer of semiconducting material, wherein the insulating layer separates the channel from the substrate; a tunnel dielectric layer disposed above the substrate over the channel region; and a multi-layer charge-trapping region including a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer disposed above the first nitride layer, and a second deuterated layer disposed above the second nitride layer, wherein the second nitride layer comprises a, deuterium-free trap-dense, oxygen-lean nitride layer and includes a majority of charge traps distributed in the multi-layer charge-trapping region, and the first nitride layer comprises a substantially trap-free oxygen-rich nitride layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A charge trap memory device, comprising:
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a layer of semiconducting material overlying a surface of a substrate; a source region, a drain region, and a channel region electrically connecting the source region and drain region formed in the layer of semiconducting material; a tunnel dielectric layer disposed on the substrate over the channel region; a multi-layer charge-trapping region including a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer disposed above the first nitride layer, and a second deuterated layer disposed above the second nitride layer; a blocking dielectric layer disposed on the second deuterated layer, the second deuterated layer separating the second nitride layer from the blocking dielectric layer; and a gate layer disposed on the blocking dielectric layer, wherein the first nitride layer comprises a substantially trap-free oxygen-rich nitride layer. - View Dependent Claims (9, 10, 11)
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12. A charge trap memory device, comprising:
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a layer of semiconducting material overlying a surface of a substrate; a source region, a drain region, and a channel region electrically connecting the source region and drain region formed in the layer of semiconducting material; a tunnel dielectric layer disposed above the substrate over the channel region; and a multi-layer charge-trapping region including a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer disposed above the first nitride layer, and a second deuterated layer disposed above the second nitride layer, wherein the second deuterated layer has a concentration of deuterium lower than a concentration of deuterium in the first deuterated layer, and wherein first nitride layer comprises a substantially trap-free oxygen-rich nitride layer. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification