Low power and small form factor infrared imaging
First Claim
1. A system comprising:
- a sensor assembly implemented as a focal plane array (FPA) comprising;
a low-dropout regulator (LDO) adapted to provide a regulated voltage in response to an external supply voltage;
an array of infrared sensors adapted to image a scene;
a bias circuit connected to the LDO, the bias circuit adapted to provide an adjustable bias voltage to the array of infrared sensors in response to the regulated voltage;
a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames; and
wherein the LDO, the array of infrared sensors, the bias circuit, and the ROIC are integrated together using a shared substrate.
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Accused Products
Abstract
Various techniques are provided for implementing an infrared imaging system, especially for low power and small form factor applications. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. A low-dropout regulator (LDO) is integrated with the FPA and adapted to provide a regulated voltage in response to an external supply voltage. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors in response to the regulated voltage. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
224 Citations
20 Claims
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1. A system comprising:
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a sensor assembly implemented as a focal plane array (FPA) comprising; a low-dropout regulator (LDO) adapted to provide a regulated voltage in response to an external supply voltage; an array of infrared sensors adapted to image a scene; a bias circuit connected to the LDO, the bias circuit adapted to provide an adjustable bias voltage to the array of infrared sensors in response to the regulated voltage; a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames; and wherein the LDO, the array of infrared sensors, the bias circuit, and the ROIC are integrated together using a shared substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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receiving an external supply voltage at a sensor assembly implemented as a focal plane array (FPA); providing a regulated voltage in response to the external supply voltage using a low-dropout regulator (LDO); providing an adjustable bias voltage to an array of infrared sensors of the FPA in response to the regulated voltage using a bias circuit of the FPA, wherein the bias circuit is connected to the LDO; imaging a scene using the infrared sensors; providing signals from the infrared sensors corresponding to captured image frames using a read out integrated circuit (ROIC) of the FPA; and wherein the LDO, the array of infrared sensors, the bias circuit, and the ROIC are integrated together using a shared substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification