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Low power and small form factor infrared imaging

  • US 9,716,844 B2
  • Filed: 12/18/2013
  • Issued: 07/25/2017
  • Est. Priority Date: 06/10/2011
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a sensor assembly implemented as a focal plane array (FPA) comprising;

    a low-dropout regulator (LDO) adapted to provide a regulated voltage in response to an external supply voltage;

    an array of infrared sensors adapted to image a scene;

    a bias circuit connected to the LDO, the bias circuit adapted to provide an adjustable bias voltage to the array of infrared sensors in response to the regulated voltage;

    a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames; and

    wherein the LDO, the array of infrared sensors, the bias circuit, and the ROIC are integrated together using a shared substrate.

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