Method of manufacturing a stimulation lead
First Claim
1. A method of manufacturing a stimulation lead comprising:
- providing a plurality of conductive contacts located at an end of a lead body and providing a plurality of conductor wires disposed in a plurality of conductor lumens formed in the lead body and extending beneath one or more of the conductive contacts, wherein each of the conductor wires is disposed within one of the plurality of conductor lumens and each of the conductor lumens of the plurality of conductor lumens has at least one of the conductor wires of the plurality of conductor wires disposed therein, wherein a portion of each of the conductor wires is disposed radially beneath at least one of the conductive contacts;
connecting at least one of the plurality of conductor wires to each of the conductive contacts; and
placing non-conductive material into a void space beneath the conductive contacts that is not occupied by the conductor wires, wherein at least a portion of the non-conductive material is radially disposed beneath at least one of the conductive contacts.
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Accused Products
Abstract
A method of making a stimulation lead is provided. The method of making a multi-contact stimulation lead comprises placing monofilament placed in the void spaces not occupied by the plurality of conductor wires and, in one embodiment, thermally fusing the monofilament to the like material spacer by applying heat just below the melting temperature of the monofilament and spacer material. Alternatively, the monofilament and spacer may be of different materials and heat is applied to cause at least one material to thermally reflow or melt. The conductive contacts may be located at either the distal end and/or proximal end of the lead. Oversized spacers may be used in order to provide extra material to fill voids during the thermal fusion/reflow process.
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Citations
20 Claims
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1. A method of manufacturing a stimulation lead comprising:
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providing a plurality of conductive contacts located at an end of a lead body and providing a plurality of conductor wires disposed in a plurality of conductor lumens formed in the lead body and extending beneath one or more of the conductive contacts, wherein each of the conductor wires is disposed within one of the plurality of conductor lumens and each of the conductor lumens of the plurality of conductor lumens has at least one of the conductor wires of the plurality of conductor wires disposed therein, wherein a portion of each of the conductor wires is disposed radially beneath at least one of the conductive contacts; connecting at least one of the plurality of conductor wires to each of the conductive contacts; and placing non-conductive material into a void space beneath the conductive contacts that is not occupied by the conductor wires, wherein at least a portion of the non-conductive material is radially disposed beneath at least one of the conductive contacts. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a stimulation lead comprising:
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providing a plurality of conductive contacts located at an end of a lead body and providing a plurality of conductor wires disposed in a plurality of conductor lumens formed in the lead body and extending beneath one or more of the conductive contacts, wherein each of the conductor wires is disposed within one of the plurality of conductor lumens and each of the conductor lumens of the plurality of conductor lumens has at least one of the conductor wires of the plurality of conductor wires disposed therein, wherein a portion of each of the conductor wires is disposed radially beneath at least one of the conductive contacts; connecting at least one of the plurality of conductor wires to each of the conductive contacts; placing non-conductive material into a void space beneath the conductive contacts that is not occupied by the conductor wires, wherein at least a portion of the non-conductive material is radially disposed beneath at least one of the conductive contacts; and after placing the non-conductive material, heating the non-conductive material to cause the non-conductive material to thermally reflow or melt beneath the conductive contacts. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification