Systems and methods to connect sintered aluminum electrodes of an energy storage device
First Claim
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1. An apparatus comprising:
- a cathode;
a separator stacked in alignment with the cathode;
an anode assembly disposed in a stack with the cathode and the separator, the separator disposed between the cathode and the anode assembly to physically separate the cathode and the anode assembly, wherein the anode assembly includes;
a first layer including a first sintered material deposited on a first substrate;
a second layer stacked with the first layer, the second layer including a second sintered material deposited on a second substrate, wherein the first substrate of the first layer and the second substrate of the second layer are proximate each other and between the first sintered material and the second sintered material; and
an interconnect coupled to the first substrate and the second substrate to electrically couple the first layer and the second layer of the anode assembly, wherein the interconnect includes a conductive element disposed between the first substrate and the second substrate, and wherein the first substrate and the second substrate are substantially sinter-free along a path of the conductive element.
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Abstract
This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb-shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.
113 Citations
12 Claims
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1. An apparatus comprising:
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a cathode; a separator stacked in alignment with the cathode; an anode assembly disposed in a stack with the cathode and the separator, the separator disposed between the cathode and the anode assembly to physically separate the cathode and the anode assembly, wherein the anode assembly includes; a first layer including a first sintered material deposited on a first substrate; a second layer stacked with the first layer, the second layer including a second sintered material deposited on a second substrate, wherein the first substrate of the first layer and the second substrate of the second layer are proximate each other and between the first sintered material and the second sintered material; and an interconnect coupled to the first substrate and the second substrate to electrically couple the first layer and the second layer of the anode assembly, wherein the interconnect includes a conductive element disposed between the first substrate and the second substrate, and wherein the first substrate and the second substrate are substantially sinter-free along a path of the conductive element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification