Apparatus for optical emission spectroscopy and plasma treatment apparatus

• US 9,721,768 B2
• Filed: 04/02/2016
• Issued: 08/01/2017
• Est. Priority Date: 04/07/2015
• Status: Active Grant

• Current Assignee: Industry Academic Cooperation Foundation, Samsung Electronics Co. Ltd.
• Original Assignee: Industry Academic Cooperation Foundation, Samsung Electronics Co. Ltd.
• Inventors: Kim, In-Joong, Yun, Ilgu
• Primary Examiner(s): Nur, Abdullahi
• Application Number:
  US15/089,520
• Publication Number:
  US 20160300699A1
• Time in Patent Office: 486 Days
• CPC Class Codes: G01J 3/0202 Mechanical elements; Supports for optical elements
• CPC Class Codes: G01J 3/0221 the fibers defining an entry slit
• CPC Class Codes: G01J 3/0248 using a sighting port, e.g. camera or human eye
• CPC Class Codes: G01J 3/0289 Field-of-view determination; Aiming or pointing of a spectrometer; Adjusting alignment; Encoding angular position; Size of measurement area; Position tracking
• CPC Class Codes: G01J 3/443 Emission spectrometry
• CPC Class Codes: H01J 37/32917 Plasma diagnostics
• CPC Class Codes: H01J 37/32972 Spectral analysis

Abstract

Disclosed is an apparatus for optical emission spectroscopy which includes a light measuring unit measuring light in a process chamber performing a plasma process on a substrate, a light analyzing unit receiving light collected from the light measuring unit to analyze a plasma state, a control unit receiving an output signal of the light analyzing unit to process the output signal, and a light collecting controller disposed between the process chamber and the light measuring unit so as to be combined with the light measuring unit. The light collecting controller controls the light collected to the light measuring unit.

Claims

1. An apparatus for optical emission spectroscopy, the apparatus comprising:

a light measuring unit, which measures light in a process chamber that performs a plasma process on a substrate;

a light analyzing unit, which receives light collected from the light measuring unit to analyze a plasma state;

a control unit, which receives an output signal of the light analyzing unit to process the output signal; and

a light collecting controller disposed between the process chamber and the light measuring unit so as to be combined with the light measuring unit, the light collecting controller controlling the light collected to the light measuring unit;

wherein the light collecting controller controls an incident range of the collected light; and

wherein the light collecting controller has an inner diameter that is larger than that of an inner diameter of the light measuring unit.

2. The apparatus of claim 1, wherein the light collecting controller has a cylindrical shape.

3. The apparatus of claim 1, further comprising:

a rotating unit, which rotates the light measuring unit.

4. The apparatus of claim 1, wherein the light measuring unit is inserted into the light collecting controller.

5. The apparatus of claim 1, wherein one end of the light measuring unit is embedded in the light collecting controller.

6. The apparatus of claim 5, wherein the light collecting controller comprises:

a body surrounding the one end of the light measuring unit;

an adjusting unit embedded in the body and controlling the collected light;

an elastic member disposed to be adjacent to one end of the adjusting unit disposed in the body; and

an adjusting pin adjusting the elastic member to control a position of another end of the adjusting unit from the light measuring unit.

7. The apparatus of claim 1, wherein the light collecting controller further comprises:

an aperture disposed in the light collecting controller and controlling the collected light.

8. The apparatus of claim 7, wherein the light collecting controller further comprises:

an adjusting pin controlling the aperture to control the amount of the collected light.

9. The apparatus of claim 1, wherein the light collecting controller controls the amount of the collected light.

10. A plasma treatment apparatus comprising:

a process chamber having an inner space in which plasma is generated to treat a substrate, the process chamber having a window for monitoring the inner space; and

an apparatus for optical emission spectroscopy which measures light in the process chamber to analyze a plasma state in the process chamber,

wherein the apparatus for optical emission spectroscopy comprises;

a light measuring unit, which measures the light in the process chamber through the window;

a light analyzing unit, which receives the light collected from the light measuring unit to analyze the plasma state;

a control unit, which receives an output signal of the light analyzing unit to process the output signal; and

a light collecting controller disposed between the process chamber and the light measuring unit so as to be combined with the light measuring unit, the light collecting controller controlling the light collected to the light measuring unit;

wherein the light collecting controller controls an incident range of the collected light; and

wherein the light collecting controller has an inner diameter that is larger than that of an inner diameter of the light measuring unit.

11. The apparatus of claim 10, wherein the light collecting controller has a cylindrical shape.

12. The plasma treatment apparatus of claim 10, wherein the apparatus for optical emission spectroscopy further comprises:

a rotating unit, which rotates the light measuring unit.

13. The plasma treatment apparatus of claim 10, wherein the light measuring unit is inserted into the light collecting controller.

14. The plasma treatment apparatus of claim 10, wherein one end of the light measuring unit is embedded in the light collecting controller.

15. An apparatus for optical emission spectroscopy, the apparatus comprising:

a light collecting controller;

wherein the light collecting controller has an aperture that controls an incident range of the light collected from a window of a process chamber that performs a plasma process on a substrate;

a light measuring unit, which measures light received from the light collecting controller;

wherein the light collecting controller has one end that is embedded in the light measuring unit;

wherein the aperture of the light collecting controller controls an amount of the light that reaches the light measuring unit from the light collecting controller;

a light analyzing unit, which receives light from the light measuring unit to analyze a plasma state; and

a control unit, which receives an output signal of the light analyzing unit to process the output signal, wherein the light collecting controller has an inner diameter that is larger than that of an inner diameter of the light measuring unit.

16. The apparatus of claim 15, further comprising:

a rotating unit rotating the light measuring unit.

17. The apparatus of claim 15, wherein the light collecting controller comprises:

a body surrounding the one end of the light measuring unit;

an adjusting unit embedded in the body and controlling the collected light;

an elastic member disposed to be adjacent to one end of the adjusting unit disposed in the body; and

an adjusting pin adjusting the elastic member to control a position of another end of the adjusting unit from the light measuring unit.

18. The apparatus of claim 17, wherein the light collecting controller further comprises:

an adjusting pin controlling the aperture to control the amount of the collected light.

19. The apparatus of claim 15, wherein the light collecting controller may be controlled to receive only light from a portion of an entire surface area of a substrate in a process chamber.